Full Site - : component case sizes (Page 4 of 714)

Nam Tai Electronics, Inc. Starts Investing in Image Sensor Manufacturing and Bluetooth� Wireless Technology Production

Industry News | 2003-06-10 08:56:19.0

Seeing the increasing number of electronic products having image capturing functions in the market, the Company has decided to seek to further augment its manufacturing capabilities to produce image sensors to satisfy order demand for these components.

SMTnet

CirTran Receives Order From U.S. Government Agency

Industry News | 2003-02-27 08:13:16.0

The order was placed through CirTran's wholly owned subsidiary, Racore Technology Corporation.

SMTnet

Freudenberg Mektec Builds European Dealer Network for Flex PCBs

Industry News | 2003-04-03 08:29:50.0

The company intends to avoid common barriers of differing languages and business mentalities through the newly created network

SMTnet

Integrated Test Corporation Partners with MIRTEC for Total Quality 3D AOI Solution

Industry News | 2020-05-18 13:26:01.0

MIRTEC is pleased to announce that Integrated Test Corporation, a leading fabricator of ATE probe and final test PCBs, has selected MIRTEC as their 3D AOI partner with the purchase of an MV-7U OMNI Large Format PCB 3D AOI Machine.

MIRTEC Corp

MIRTEC to Exhibit Its Award-Winning MV-6Z OMNI 3D AOI System at SMTAI 2021 Minneapolis, MN

Industry News | 2021-10-04 13:48:55.0

MIRTEC is pleased to announce their plans to exhibit at the SMTA International Exposition, scheduled to take place Nov. 3-4, 2021, at the Minneapolis Convention Center in Minneapolis, MN. The MIRTEC team is looking forward to meeting with attendees at booth #3500 for a detailed demonstration of its MV-6Z OMNI 3D In-Line AOI system.

MIRTEC Corp

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

Nam Tai Electronics, Inc. Appoints Mr. Guy Bindels As Research and Development Director

Industry News | 2003-03-05 08:35:10.0

he will be responsible for formulating R&D strategies and spearheading the Company to keep abreast of the latest development in global manufacturing technology as well as strengthen its R&D division.

SMTnet

MIRTEC to Display the 'World's Most Technologically Advanced' 3D AOI System at Productronica 2023

Industry News | 2023-10-16 12:50:01.0

MIRTEC announces the release of their All-New ART Hybrid 3D AOI System at Productronica 2023. The World's leading trade fair for the electronics manufacturing industry will take place Nov. 14-17, 2023, at the Trade Fair Center Messe München, Germany. All are welcome to MIRTEC's Booth #461 in Hall A2 for a detailed demonstration of what will undoubtedly be recognized as the World's Most Technologically Advanced 3D AOI System!

MIRTEC Corp

MIRTEC TO EXHIBIT A NEW INSPECTION SYSTEM WITH THE PERFECT INSPECTION SOLUTION AT NEPCON CHINA 2017

Industry News | 2017-04-24 19:04:48.0

This year, MIRTEC will launch several new inspection machines equipped new cutting-edge technologies. MIRTEC is proud to be promoting these new machines in booth #1J10 at NEPCON China 2017, one of the biggest technical exhibitions of SMT and EMA, from April 25-27 at the Shanghai World EXPO Exhibition & Convention Center. MIRTEC’s new machines have been developed under a concept, ‘Perfect Inspection Solution’. This is an inspection concept involving the combination of 3D, 2D, and side-camera inspection.

MIRTEC Corp

MIRTEC Features Award-Winning 3D AOI and SPI Systems at SMTAI 2018

Industry News | 2018-09-17 19:37:42.0

MIRTEC, “The Global Leader in Inspection Technology,” announces plans to exhibit at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL. The company will premier its award-winning MV-6 OMNI 3D AOI and MS-11e 3D SPI systems Booth #208.

MIRTEC Corp


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