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Welcome to this Defect of the Month video on simple solderability testing, this series of videos were produced for and featured as part of the NPL/IPC video library and examples are taken from the NPL Defect Database. Over the last couple of years th
Contact Joy Rong for details and price list WhatsApp/wechat/Skype?+86 18779975930 Email: joyrongzhuomao@outlook.com Email: info@seamarkxray.com Web: www.seamarkxray.com Features: Automatic component recognition - Automated parameter setting and co
Used SMT Equipment | Pick and Place/Feeders
MyData (MyCronic) My9 Serial No: 5576 Manufactured: 10/27/2006 Up Time: 166 days Assembly Time: 35 days Software Options: Electrical testing Optical centering Conveyors Shared database Hydra 14k High speed Z Autoteach Hydra large compo
Industry News | 2012-03-14 13:51:17.0
Reel aMounts component counting system now counts reels in seconds and reels loaded in feeders, reels in twin-track feeders, even reels loaded in feeders, still mounted in the pick and place machine.
Industry Directory | Media / Publisher / Online Resource
ERAI is an information services organization that monitors, investigates and reports issues that are affecting the electronics supply chain.
Career Center | Addison,Texas, Texas USA | Engineering
NO SPONS,YES WILL RELO, KEY WORDS,GENRAD 228X,HP3070 TEST EQUIPMENT.PLEASE POST. Designing, developing and maintaining test procedures, tester hardware and software for electronic circuit board production. Reviewing circuit board design for testabili
Technical Library | 2022-10-31 17:30:40.0
This paper presents a quantitative analysis of solder joint reliability data for lead-free Sn-Ag-Cu (SAC) and mixed assembly (SnPb + SAC) circuit boards based on an extensive, but non-exhaustive, collection of thermal cycling test results. The assembled database covers life test results under multiple test conditions and for a variety of components: conventional SMT (LCCCs, resistors), Ball Grid Arrays, Chip Scale Packages (CSPs), wafer-level CSPs, and flip-chip assemblies with and without underfill. First-order life correlations are developed for SAC assemblies under thermal cycling conditions. The results of this analysis are put in perspective with the correlation of life test results for SnPb control assemblies. Fatigue life correlations show different slopes for SAC versus SnPb assemblies, suggesting opposite reliability trends under low or high stress conditions. The paper also presents an analysis of the effect of Pb contamination and board finish on lead-free solder joint reliability. Last, test data are presented to compare the life of mixed solder assemblies to that of standard SnPb assemblies for a wide variety of area-array components. The trend analysis compares the life of area-array assemblies with: 1) SAC balls and SAC or SnPb paste; 2) SnPb balls assembled with SAC or SnPb paste.
Used SMT Equipment | Pick and Place/Feeders
Make: FUJIModel: FUJI NXT M6IIDetails:1.High Productivity: The FUJI NXT M6II boasts an industry-leading area productivity of 81,300cph/m².2.Flexibility: Supports both dual and single conveyance systems for various circuit board sizes.3.Large Panel S
