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BEST HotDots™ are designed to simply and cleanly attach jumper wires on a board. HotDots™ are built to survive at high temperature as both the adhesive and the polyimide material are designed to withstand wash and reflow temperatures. HotDots™ are a
Petroferm offers a complete line of aqueous and semi-aqueous cleaning chemistries for use in batch and inline spray-in-air cleaning equipment. These cleaning materials are used for defluxing (removing post reflow solder paste residues) circuit boards
Electronics Forum | Mon Sep 20 10:17:19 EDT 1999 | Jeanjean
Hi all, As a student in elctronic sciences, I'd like to know why there is a difference in the voltage required for PC boards with surface mounted devices and the voltage needed by traditionnal components like leaded film capacitors? I wonder if it
Electronics Forum | Mon Sep 20 11:50:26 EDT 1999 | Wolfgang Busko
| Hi all, | | As a student in elctronic sciences, I'd like to know why there is a difference in the voltage required for PC boards with surface mounted devices and the voltage needed by traditionnal components like leaded film capacitors? | | I won
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2023-09-23 22:29:02.0
Moisture trapped within components and PBs presents a serious problem during the fabrication and assembly process. Too much moisture can lead to board failures when it is turned to steam during the reflow process.
Good Quality Hot Air Lead Free Led Reflow Oven in SMT Line ❙ Introduce of Reflow Soldering Oven ETA advanced reflow oven, reflow soldering, reflow soldering oven, SMT reflow oven technology | 25 years SMT technology experience | pro
Imbedded Component/Die Technology (IC/DT®) News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing! Imbedded Component/Die Technology (IC/DT®) STI has developed a patented
Imbedded Component/Die Technology (IC/DT®) News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing! Imbedded Component/Die Technology (IC/DT®) STI has developed a patented
Heller Industries Inc. | https://hellerindustries.com/component-cracking/
Component Cracking Home » Component Cracking Re-printed in partnership with ITM Component Cracking Cracking of multilayer ceramic capacitors has been attributed to excessive heating rates during reflow
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