Industry Directory | Manufacturer
Qualitetch utilse photo etching, wire EDM, laser cutting, metal forming, machining to offer the "Total Metal Component Solution" to customers requiring thin gauge metal components in most metals.
Industry Directory | Manufacturer
Argus is Leading Supplier of professional Grade Printed Circuited Boards.We are specialized in quick turnaround of Prototypes and small to medium scale production.
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Used SMT Equipment | Pick and Place/Feeders
Heavy-duty, welded steel base frame w/ adjustable foot pads High-precision ball screw X-Y drive mechanism w/ linear encoders Three pick and place heads, each with servo-driven Z- and ?-axis motors Standard on-the-fly vision alignment cameras for c
Used SMT Equipment | Pick and Place/Feeders
MC389CY-F3-V MC-389 High-Speed, High-Mix Pick & Place WITH CONVEYOR Heavy-duty, welded steel base frame w/ adjustable foot pads High-precision ball screw X-Y drive mechanism w/ linear encoders Three pick and place heads, each with servo-drive
Industry News | 2014-01-17 12:52:25.0
BEST Inc., has developed a line of Kapton™ SMT stencils for the prototype assembly market. These stencils, available in 4,5 and 6 thicknesses, present very flat coplanar printing surfaces for solder paste printing. . They are designed to be used when the there are very few boards to be made at one time and the pitch of the components is 1.00 and above.
Industry News | 2013-09-03 11:52:21.0
BEST's EZReball(TM) reballing preforms now are available as standard in 3 business days. Expedited packs are in available in 24 hours to help you with your reballing projects
Technical Library | 2023-09-18 14:10:01.0
As with many advancements in the electronics industry, consumer electronics is driving the trends for electronic packaging technologies toward reducing size and increasing functionality. Microelectronics meeting the technology needs for higher performance, reduced power consumption and size, and off the- shelf availability. Due to the breadth of work being performed in the area of microelectronics packaging/components, this report limits it presentation to board design, manufacturing, and processing parameters on assembly reliability for leadless (e.g., quad flat no-lead (QFN) or a generic term of bottom termination component (BTC)) packages. This style of package was selected for investigation because of its significant growth, lower cost, and improved functionality, especially for use in an RF application.
Technical Library | 2000-11-13 20:45:03.0
Free 16 page guide quickly explains how to read Dummy Component and test vehicle part numbers. Covers CSP, BGA, QFP, SOIC, Flip Chips, flat packs and discretes and chips.
KS6V LED Placement Machine Domestic Applicable to: fluorescent tubes,flexible light strips,flat lights,outdoor lights,ceiling lights, bulbs,terminals,power supplies,etc. Product name 6V (six head placement machine)
FKN Systek K3000 - Singulate scored and skip scored panels up to 24" long ESD protective mat on back table Adjustable front and back support table Singulate panels with components up to 2.5" high Available in 18" blade (standard) or 24" blade (
Events Calendar | Tue Dec 01 18:30:00 UTC 2020 - Thu Dec 03 18:30:00 UTC 2020 | Chiba, Japan
FINETECH JAPAN - FPD Exhibition & Conference
Career Center | Nashville, North Carolina USA | Production
MUST BE WILLING TO BECOME FULLY VACCINATED FOR COVID-19, OR QUALIFY FOR A RECOGNIZED EXEMPTION, TO WORK AT ACDI IF GOVERNMENT CONTRACTOR REGULATIONS ARE UPHELD. OUR COMPANY What we do day-in and day-out has a lasting, meaningful impact across man
SMTnet Express, July 23, 2015, Subscribers: 23,004, Members: Companies: 14,461 , Users: 38,507 Reliability Study of Bottom Terminated Components Jennifer Nguyen, Hector Marin, David Geiger, Anwar Mohammed, Murad Kurwa; Flextronics International
| https://www.eptac.com/faqs/ask-helena-leo/ask/bottom-termination-parts
component suppliers regarding the issues being faced in the assembly process”. Now in section 5.2.6 Flatness (Bow and Twist) it discusses board flatness and how it is measured and what the percentages are and provides no further information
ORION Industries | http://orionindustries.com/pdfs/SILPAD900S.pdf
. These applications also typically have low mounting pressures for component clamping. Sil-Pad 900S material combines a smooth and highly compliant surface characteristic with high thermal conductivity
