Electronics Forum | Wed Jun 29 18:11:13 EDT 2005 | GS
Start from this: - check the air flow speed, if too much it can help to get components moved/blowed away. - Other cause (not so often)it could be moisture in PCB, so when degassing, may be trough vias, the pressure could blow away components. Regar
Electronics Forum | Mon Aug 13 10:00:18 EDT 2007 | ed_faranda
Might want to check to see if the weight of your part has increased. If it has increased, you may not have enough surface tension to hold the part on the board. I am assuming you already checked that the component isn't getting hit by something in
Electronics Forum | Wed Oct 10 20:35:17 EDT 2001 | djarvis
Stephen, I don't understand this at all mate. 1. If you don't place a QFP and get bridging across the bare pads, you were gonna get absolutely horrendous bridging if you did put one down. That points to poor printer set up or stencil design or both
Electronics Forum | Thu May 18 08:31:28 EDT 2006 | marc
Hi James Short answer... yes... long answer...impingement velocity is excellent for heat transfer but it also is a higher risk of moving components. Variable speed blowers allow you to reduce the speed / impingment and more than likly your compone
Electronics Forum | Thu Mar 14 17:28:35 EST 2002 | stepheno
I worked with Fuji CP6 where one of the techs wanted a minimum of part data's. He was used to working with panasonic machines. We would get resistors broken in two if the part data was too small and parts flying off the board if the part data was t
Electronics Forum | Fri May 27 02:39:45 EDT 2005 | Base
Hate to say it but I'm gooing to anyway: buy a book and get a course!!! I understand your need for information, but most (if not all) of your questions concern very basic knowledge. I appreciate your needs, but by posting ALL of these questions the
Electronics Forum | Tue Apr 11 15:37:31 EDT 2006 | stockley
(Hey Cal how you doing?) I can't resist this. You can sort of do what you're hoping for but you have to be very careful. Let the component run out and let the machine get as far as it's going to go. Then go to "Software Options", "Test commands" then
Electronics Forum | Fri Jun 14 14:25:05 EDT 2002 | davef
Good job clarifying things. So, your MELF are just rolling off the pads. So much for the rocket scientist that talked you into those �V� shaped apertures, eh? [Or taking it the other way: Wow, just think how bad it would be if they weren�t worki
Electronics Forum | Fri Sep 07 04:25:52 EDT 2012 | grahamcooper22
As soon as the oven temp falls below 40 C and the RH rises above 5% then you need to consider that the floor clock will start. Long term storage of devices in an oven is not good for them as it reduced their solderability and can affect their perform
Electronics Forum | Mon Feb 13 10:41:14 EST 2017 | dyoungquist
Could be that your temperature ramp up rate is too fast. This could cause the flux in the solder paste to burn off too rapidly. When that happens, it can expand as it heats up and burns off, causing the solder to get spread out from the pad.