Industry Directory | Standards Setting / Certification / Training Provider
EPTAC is an internationally recognized solder training and IPC certification corporation, giving professionals the skills to accelerate their careers, and businesses the talent to succeed.
Industry Directory | Consultant / Service Provider / Manufacturer
PLTc bv, the #1 design house for printed circuit boards in The Netherlands which offers a very complete range of services in printed circuit boards, flexes and flex-rigid PCB's for professional electronics.
New Equipment | Board Handling - Conveyors
Microcomputer control, stable and reliable. >LCD screen display, menu interface, the man-machine dialogue is convenient. >Many sound-light alarm function. >So can use standard feeder, strong commonality. >According to the thickness of the PCB so
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Smt I-pulse K01 nozzle used in pick and place machine Smt I-pulse K01 nozzle used in pick and place machine I-pulse series nozzles: 1.M1/M4 type:M001/M002/M003/M004/M005/M006/M012/M013/M017/M018/M019/M020/M021/M022/M031/M032/M033 2.M2 type:N001/N00
Electronics Forum | Fri Nov 17 15:04:59 EST 2006 | ehess
WE have a problem with a DPAK component floating during reflow, causing it to move to the point where it affects the toe fillet. We have been using a dot of SMT epoxy to hold it secure for the moment. I have looked on many sites, but no whrere can
Electronics Forum | Fri Jan 06 05:03:11 EST 2012 | richieoreilly
Hi All, Just wondering if anyone is placing 0201 components in volume. If so What pad layout are you using, i.e. pad size, shape and spacing. Also are you pads and fiducials solder mask defined or copper defined. Can you also let me know the rough q
Used SMT Equipment | Pick and Place/Feeders
Refurbished YAMAHA YV100XG SMT Pick and Place Machine Machine Type YV100XG Substrate size M type L460 * W335 (MAX) -L50 * W50 (MIN) L type L460 * W440 (MAX) -L50 * W50 (MIN) Mounting accuracy Absolute accuracy (μ + 3σ): ± 0
Used SMT Equipment | Pick and Place/Feeders
Make: FUJIModel: FUJI AIMEXIIIC Details:1.High-Speed Mounting Capability: The FUJI XPF-L mounting machine boasts a mounting speed of up to 25,000 CPH .2.Automatic Head Changer: It features the world's first automatic head changer technology, allowin
Industry News | 2016-06-27 14:59:09.0
GPD Global introduces the NEW TempView Thermal Imaging System that ensures the success of heated dispensing processes like Underfill, Encapsulations, Dam and Fill, and more. The TempView Thermal Imaging System monitors the temperature of the entire substrate for complete heat profile characterization. Regions of the product may be selected for monitoring during the heating process. Now you can accurately monitor temperature of specific devices to be sure they are up to temperature before starting a process.
Industry News | 2017-04-11 21:19:32.0
GPD Global offers versatile large format inline dispensing systems and stand-alone liquid dispense technologies for maximizing product yield. This is the largest standard PCB dispensing system platform in the industry.
Parts & Supplies | Circuit Board Assembly Products
PULANG TECHNOLOGY CO,.LTDOffers electronic manufacturing services including PCB designing, electronic contract manufacturing including electronic product design, electronic product development, electronic product repair, PCB manufacturing, electronic
Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
In-line or stand-alone fluxer/pre-heater This compact modular in-line system utilises the same design concept as the new generation Synchrodex soldering cell and offers the user significantly reduced process time when compared to using a single sold
The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Training Courses | | | IPC Designer Certification CID
The Certified IPC Designer CID (Certified Interconnect Designer) course is the industry's premier professional development program for experienced PCB design professionals.
Events Calendar | Tue Apr 21 00:00:00 EDT 2020 - Thu Apr 23 00:00:00 EDT 2020 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference
Events Calendar | Tue May 17 00:00:00 EDT 2022 - Thu May 19 00:00:00 EDT 2022 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference and Exhibition
Career Center | Burbank, California USA | Production
SMT Machine Operator Requirements: Set-up, and operate SMT Machinery Knowledge of PCB layout, fabrication and prototyping PCB layout, component placement, and routing Solder-Paste SMT placement machines and programming Pick-n-
Career Center | Fremont, California USA | Engineering
Interprets electrical design requirements and uses Allegro design tool to create original PCB layouts, detailed fab drawings, schematics, and other design files. Work with HW design engineer to make sure PCB layout meet PCB design requirements.
Career Center | Torrington, Connecticut | Engineering,Management,Production,Quality Control,Sales/Marketing,Technical Support
MECHANICAL AND ELECTRONIC CAD TECHNOLOGY-CERTIFICATION • TECHNICAL DRAFTING: Equipment Use, Orthographic Projection, Dimensioning, Auxiliary Views, Fasteners, Manufacturing Processes and Fits and Tolerances • POWER TRANSMISSION/ANSI 14.5 1994: Bearin
Career Center | Palm Bay, Florida USA | Engineering,Production
1 year of SMT production experience in a low/med volume, high mix environment. IPC-A-610 Certified Specialist. Reflow profiling experience Heavy CAM programming experience with prototypes and new products
| https://www.eptac.com/wp-content/uploads/2021/10/EPTAC_DataSheet_AdvMicroSMT.pdf
Layout 1 800-643-7822 eptac.com eptaccanada.ca Download the App at eptacapp.com TRAINING ■ Expert Training in the Latest Technologies
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/brand/identity/layout-application-and-design-grids
.zip file package contains Adobe InDesign layout grids in both Letter and A4 size format. Nordson Nordson EFD Nordson ELECTRONICS SOLUTIONS Nordson MEASUREMENT
