Full Site - : component lead length (Page 7 of 1313)

REMEC Deploys AWR Design Flow Worldwide

Industry News | 2003-06-09 09:16:38.0

The adoption of AWR EDA software supports REMEC�s continuous efforts to manage the substantial challenges of today�s wireless design technology.

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parvus Corp. Now Shipping its Biothenticator� PC/104 Biometric Fingerprint Sensor Module for Embedded System User Authentication

Industry News | 2003-03-27 08:15:33.0

Modular Embedded Circuit Board from parvus Enables Local Device Fingerprint Biometrics

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Freudenberg Mektec Builds European Dealer Network for Flex PCBs

Industry News | 2003-04-03 08:29:50.0

The company intends to avoid common barriers of differing languages and business mentalities through the newly created network

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DPAC Technologies Strengthens Board of Directors with New Independent Board Member

Industry News | 2003-04-28 07:47:37.0

DPAC exceeds requirements of Sarbanes-Oxley Act in independence and financial expertise for the DPAC Technologies Board

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AutoTRAX EDA Ltd. Appoints John Shotsky, Former Orcad Product Manager, as EDA Tools Product Manager

Industry News | 2003-02-04 08:49:40.0

John Was the Product Manager for Orcad's Schematic Capture and PCB Layout Programs from 1994 to 2001

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CirTran Receives Multiple Follow-On Orders from Dynojet Research

Industry News | 2003-03-10 08:33:30.0

For the manufacture of Power Commander cable assemblies.

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Sales and Result Improved: VOGT electronic on the Right Course

Industry News | 2003-05-29 08:30:31.0

Losses halved in the first half year � New organization of electronics group next on the agenda

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Electronics Workbench Announces Multisim 7 and Multicap 7 for Professional Circuit Engineers and Designers

Industry News | 2003-05-06 09:05:12.0

New Schematic Capture and Simulation Software Delivers Innovative Features and the Industry�s Best Price/Performance

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Optical MEMS Finding Greater Opportunities in Non-Telecom Products

Industry News | 2003-07-02 09:35:30.0

As a result, sales of optical MEMS, into segments other than telecommunications, are forecast to grow at a CAGR of 15.8% over the next five years.

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Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

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