Industry Directory: component mounting speed (244)

Beau Tech

Beau Tech

Industry Directory | Manufacturer

A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.

Surface Mount Technology Association (SMTA)

Surface Mount Technology Association (SMTA)

Industry Directory | Association / Non-Profit / Events Organizer / Training Provider

The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.

New SMT Equipment: component mounting speed (2268)

Dual Lane / Dual Temperature SMT Reflow Oven - 1910 MK5

Dual Lane / Dual Temperature SMT Reflow Oven - 1910 MK5

New Equipment | Reflow

Dual Chamber Module - Dual Chambers + Dual Blowers + Dual Heaters + Dual T/Cs. Bifurcated (Dual) chamber reflow oven allows 2 different thermal profiles to run simultaneously in the same reflow oven foot print Improved temperature uniformity acro

Heller Industries Inc.

High Volume Reflow Oven - 1936/2043 Mark5

High Volume Reflow Oven - 1936/2043 Mark5

New Equipment | Reflow

The World's Best Convection Reflow Oven The ultimate high volume production reflow oven with belt speeds up to 1.4 m/min to accommodate the fastest pick and place systems. Lead Free Certified reflow oven! Maintenance Free! Lowest Nitrogen &

Heller Industries Inc.

Electronics Forum: component mounting speed (1416)

pcb board deflection when mounting component

Electronics Forum | Sun Oct 27 07:56:58 EST 2002 | wongmanchung

Does any expert here know the specification of board deflection when we mounting component by pick and place machine? That is when the nozzle place the chip on the pcb, the board will have some deflection. And are there any requirment that we need t

pcb board deflection when mounting component

Electronics Forum | Wed Oct 30 01:23:19 EST 2002 | jasper

Normally warp max 1% of diagonal board measurement is acceptable. What's your p&p like? Some will not experience problems at all! reg Jasper

Used SMT Equipment: component mounting speed (1332)

Manncorp MC-389CY-F3-V

Manncorp MC-389CY-F3-V

Used SMT Equipment | Pick and Place/Feeders

MC389CY-F3-V MC-389 High-Speed, High-Mix Pick & Place WITH CONVEYOR Heavy-duty, welded steel base frame w/ adjustable foot pads High-precision ball screw X-Y drive mechanism w/ linear encoders Three pick and place heads, each with servo-drive

Baja Bid

Manncorp MC-389

Manncorp MC-389

Used SMT Equipment | Pick and Place/Feeders

Heavy-duty, welded steel base frame w/ adjustable foot pads High-precision ball screw X-Y drive mechanism w/ linear encoders Three pick and place heads, each with servo-driven Z- and ?-axis motors Standard on-the-fly vision alignment cameras for c

Baja Bid

Industry News: component mounting speed (2839)

Jetting Pump Configurations Now Available for Integrating into Third Party Dispense Systems.

Industry News | 2016-05-10 14:16:16.0

GPD Global offers individual pumps for integration into your existing platform – the Jetting NCM5000 Pump is one of them. The Jetting NCM5000 Pump simplifies jetting to its basic elements: hammer, pin, and nozzle. Only the pin and nozzle are wetted parts. This means easy set-up, cleaning, and upkeep.

GPD Global

Integrate Advanced Precision Auger Pump for Dispensing Small Volumes down to 01005

Industry News | 2016-08-25 17:56:34.0

GPD Global's advanced Precision Auger Pump retrofits into your dispensing system to provide excellent dispense control and repeatability. Precision Auger Pump Integration provides your process development with a broad range of functionality.

GPD Global

Parts & Supplies: component mounting speed (428)

Juki JUKI  JX-100LED

Juki JUKI JX-100LED

Parts & Supplies | Semiconductor & Solar

JUKI JX-100LED SMT machine parameters High speed SMT machine JX-100LED Size of substrate Min. 50*50 ~ Max. 800*360mm The substrate positioning mode only corresponds to the contour reference mode Component height 12.0mm Component size 0201 (metr

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Juki JUKI  KE-2080

Juki JUKI KE-2080

Parts & Supplies | Semiconductor & Solar

JUKI    KE - 2080 parameters Substrate size M-type substrate (330×250mm) L-shaped substrate (410×360mm) L-wide substrate (510 x 360mm) (optional) E-type substrate (510×460mm) Mount component height 12mm / 20mm / 25

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Technical Library: component mounting speed (69)

Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer

Technical Library | 2024-02-02 07:48:31.0

Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer In today's rapidly evolving electronics manufacturing landscape, optimizing efficiency, cost-effectiveness, and precision remains paramount. Businesses engaged in producing industrial control boards, computer motherboards, mobile phone motherboards, and mining machine boards face ongoing challenges in streamlining production processes. The integration of expensive equipment strains budgets, making the creation of an efficient, cost-effective high-speed SMT line a daunting task. However, a solution exists that seamlessly combines these elements into a singular, high-performance, and cost-effective SMT line. Let's delve into the specifics. A Comprehensive High-Speed SMT Line Our innovative solution amalgamates two pivotal components: a cutting-edge SMT (Surface Mount Technology) production line and a laser cutting line equipped with a depanelizer. The SMT Production Line The high-speed SMT line comprises several essential components, each fulfilling a unique role in the manufacturing process: 1. PCB Loader: This initial stage involves loading boards onto the production line with utmost care. Our Board Loader prioritizes safety, incorporating various safety light curtains and sensors to promptly halt operations and issue alerts in case of any anomalies. 2. Laser Marking Machine: Every PCB receives a unique two-dimensional code or barcode, facilitating comprehensive traceability. Despite the high-temperature laser process potentially leading to dust accumulation on PCB surfaces, our dedicated PCB Surface Cleaner swiftly addresses this issue. 3. SMT Solder Paste Printer: This stage involves applying solder paste to the boards, a fundamental step in the manufacturing process. 4. SPI (Solder Paste Inspection): Meticulous inspections are conducted at this stage. Boards passing inspection proceed through the NG (No Good) Buffer Conveyor to the module mounters. Conversely, "No Good" results prompt storage of PCBs in the NG Buffer Conveyor, capable of accommodating up to 25 PCBs. Operators can retrieve these NG boards for rework after utilizing our specialized PCB Mis Cleaner to remove solder paste. 5. Module Mounters: These machines excel in attaching small and delicate components, necessitating precision and expertise in the module mounting process. 6. Standard Pick And Place Machines: The selection of these machines is contingent upon your specific BOM (Bill of Materials) list. 7. Pre-Reflow AOI (Automated Optical Inspection): Boards undergo examination for component quality at this stage. Detected issues prompt the Sorting Conveyor to segregate boards for rework. 8. Reflow Oven: Boards undergo reflow soldering, with our Lyra series reflow ovens recommended for their outstanding features, including nitrogen capability, flux recycling, and water cooling function, ensuring impeccable soldering results. 9. Post-Reflow AOI: This stage focuses on examining soldering quality. Detected defects prompt the Sorting Conveyor to segregate boards for further inspection or rework. Any identified defects are efficiently addressed with the BGA rework station, maintaining the highest quality standards. 10. Laser Depanelizer: Boards advance to the laser depanelizer, where precision laser cutting, often employing green light for optimal results, ensures smoke-free, highly accurate separation of boards. 11. PCB Placement Machine: Cut boards are subsequently managed by the PCB Placement Machine, arranging them as required. With this, all high-speed SMT line processes are concluded. Efficiency And Output This production line demonstrates exceptional productivity when manufacturing motherboards with approximately 3000 electronic components, boasting the potential to assemble up to 180 boards within a single hour. Such efficiency not only enhances output but also ensures cost-effectiveness and precision in your manufacturing processes. At I.C.T, we specialize in crafting customized SMT production line solutions tailored to your product and specific requirements. Our equipment complies with European safety standards and holds CE certificates. For inquiries or to explore our exemplary post-sales support, do not hesitate to contact us. The I.C.T team is here to elevate your electronics manufacturing to new heights of efficiency and cost-effectiveness.

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Conductive Adhesive Dispensing, Process Considerations

Technical Library | 1999-08-27 09:24:56.0

Dispensing conductive adhesives in an automated factory environment creates some special challenges. A robust production process starts with understanding the adhesives in their fluid state and which important parameters must be controlled. Developing this understanding requires experience with a large number of materials and valves over time. Common uses of conductive adhesives in surface mount applications, die attach applications, and gasketing are addressed. As vendors of dispensing equipment, the authors see a constant stream of such applications. Dispensing requirements, techniques, and equipment resulting from this experience are discussed. Guidelines for optimizing quality and speed are given.

ASYMTEK Products | Nordson Electronics Solutions

Videos: component mounting speed (1309)

Precision Lead Former for Axial Components (CF8)

Precision Lead Former for Axial Components (CF8)

Videos

Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s

GPD Global

Precision Lead Former for Raidal Components (CF9)

Precision Lead Former for Raidal Components (CF9)

Videos

The CF-9 Radial Lead Former forms and cuts 2- and 3-leaded taped radial components such as TO-92s, capacitors, transistors, LEDs, etc. - precisely and repeatedly, in standard and special forms. This machine is capable of forming and cutting up to 25

GPD Global

Training Courses: component mounting speed (206)

IPC J-STD-001 Specialist (CIS) Certification Training Course

Training Courses | | | IPC J-STD-001 Specialist (CIS)

The Certified IPC J-STD-001 Specialist (CIS) training focuses on the knowledge and hand skills employees need to produce high-quality soldered interconnections.

Blackfox Training Institute, LLC

IPC J-STD-001 Space Addendum (CIS) Certification Training Course

Training Courses | | | IPC J-STD-001 Space Specialist (CIS)

The J-STD-001 Space Addendum is an additional optional module for the Certified IPC J-STD-001 CIS (Specialist) program for organizations that are required to meet these additional requirements.

Blackfox Training Institute, LLC

Events Calendar: component mounting speed (18)

Europe Chapter Webinar: "Back-to-Basics" SMT Assembly

Events Calendar | Wed Jul 03 00:00:00 EDT 2024 - Wed Jul 03 00:00:00 EDT 2024 | ,

Europe Chapter Webinar: "Back-to-Basics" SMT Assembly

Surface Mount Technology Association (SMTA)

IPC SummerCom

Events Calendar | Sat Jun 15 00:00:00 EDT 2019 - Thu Jun 20 00:00:00 EDT 2019 | Raleigh, North Carolina USA

IPC SummerCom

Association Connecting Electronics Industries (IPC)

Career Center - Jobs: component mounting speed (77)

Automation Field Service Engineer

Career Center | Salt Lake City, Utah USA | Engineering,Maintenance,Production

My client, a Global 100 provider of high-speed automated circuit board assembly systems, seeks a professional automation technician / Field Service Engineer to assume ownership of service and customer satisfaction among their clients. Qualified cand

Electronics Search Group of MRI

Automation Field Service Engineer

Career Center | McAllen, Texas USA | Engineering,Maintenance,Production

My client, a Global 100 provider of high-speed automated circuit board assembly systems, seeks a professional automation technician / Field Service Engineer to assume ownership of service and customer satisfaction among their clients. Qualified cand

Electronics Search Group of MRI

Career Center - Resumes: component mounting speed (87)

Engineer- SMT

Career Center | , | 2013-01-31 04:29:34.0

• Programming of AOI, SPI and Routing m/c’s. • SMT(Surface Mount Technology) • Basic Electronics • Semi Conductors • Operating System: Windows- 98/XP/Vista/7 • MS Office: 2003/2007/2010

Engineer- SMT

Career Center | , | 2013-01-31 04:45:28.0

• Programming of AOI, SPI and Routing m/c’s. • SMT(Surface Mount Technology) • Basic Electronics • Semi Conductors • Operating System: Windows- 98/XP/Vista/7 • MS Office: 2003/2007/2010

Express Newsletter: component mounting speed (1028)

Partner Websites: component mounting speed (9424)

SolderTip #40: Component Mounting and Acceptability - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/soldertip/soldertip-40-component-mounting-and-acceptability/

SolderTip #40: Component Mounting and Acceptability - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more

Through hole insertion mounting component feeder-PCB magazine loader,PCB turn conveyor,pcb conformal

ASCEN Technology | https://www.ascen.ltd/Blog/machine/Componnent_preforming_cutting/961.html

Through hole insertion mounting component feeder-PCB magazine loader,PCB turn conveyor,pcb conformal coating machine,PCB router,PCB depaneling machine,pcb buffer conveyor from ASCEN technology Welcome to visit ASCEN | | | | | | | Cart

ASCEN Technology


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