I.C.T High Precision SMT PCB Dispensing Machine ❙ Introdution : Introduction: As functionality and performance increase in the electronics field, there is an increasing need for finer and more precise coatings. The HD series machine is a micro-
Industry News | 2018-04-15 20:01:15.0
SMTA Europe announces Session 4 Technical Program on Electrochemical Reliability at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Laser PCB Cutting Machine Function: The equipment is mainly used in the cutting 5G materials such as CCM / COB / LCP / MPI / COF / cop / pi / CPI in consumer electronics. The equipment integrates high-speed and high-precision optical processing syst
Industry News | 2013-05-20 16:19:35.0
IPC – Association Connecting Electronics Industries® has teamed up with PCB Libraries, Inc.
Industry News | 2020-02-20 11:16:51.0
ASYMTEK wins its 16th Service Excellence Award
FUJI M6 III High Speed Pick and Place Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place ma
FUJI Pick and Place Robot M3 III Placement If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place mach
Industry News | 2010-07-22 22:37:02.0
IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.
Industry News | 2012-02-07 00:45:44.0
IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.
Industry News | 2020-10-10 04:50:23.0
ASYMTEK, a part of Nordson ELECTRONICS SOLUTIONS announces its latest technology has received the Global Technology Award 2020 for fluid dispensing equipment. Nordson Electronics Solutions developed the patent-pending software, Automated Ratio Calibration Technology (ARC™ Technology), to enable easier set-up and sustained mix ratios for dispensing two-component (2K) fluid materials. ARC Technology is part of a system, which includes ASYMTEK Vortik® progressive cavity pumps and ASYMTEK dispensing platforms, that ensures consistently accurate mix ratios by volume or weight to improve overall dispense quality. The award was announced by Global SMT & Packaging magazine during a virtual ceremony held September 29, 2020.
