Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Industry News | 2010-02-17 19:28:14.0
Minneapolis, MN - SMTA and CALCE are pleased to announce a new Symposium on Avoiding, Detecting, and Preventing Counterfeit Electronic Parts event to be held on the west coast. The new event will take place June 8-10, 2010, in Honeywell Deer Valley, Deer Valley (Phoenix), AZ. The first three symposia were overwhelming successes with participation of part manufacturers, distributors, users, government and law enforcement agencies, legal professionals, authentication technology manufacturers, academic institutions, supply chain and brand protection professionals. Abstracts for presentations are now being accepted through April 9, 2010.
Industry News | 2015-03-24 10:48:06.0
Count On Tools announces that PB Swiss Tools has expanded its existing ESD Screwdriver selection with firmly mounted blades. SwissGrip ESD Screwdrivers are ideal even for difficult applications, with adjusted handle ergonomics. The expanded series is available for Slotted/Flat, Phillips, Pozidriv, Hex Bolts (socket wrench), Hex socket (allen key) and Torx ® screw profiles.
Used SMT Equipment | Soldering - Reflow
1. This product is made of imported stainless steel materials from Japan and is enclosed with the original Nano insulation materials from the United States. 2. This product has an extremely long service life. The general time is three to five years
Industry News | 2009-02-24 13:53:56.0
Minneapolis, MN � The SMTA is pleased to announce its industry premier in Denmark with two co-located events focusing respectively on Tin Whiskers and Counterfeit Electronic Parts issues. The events will be held from June 23-26, 2009 at the Technical University of Denmark in Lyngby.
Industry News | 2009-03-02 00:48:35.0
The SMTA and CALCE/University of Maryland are pleased to announce their industry premier in Denmark with two co-located events focusing respectively on Tin Whiskers and Counterfeit Electronic Parts issues. The events will be held June 23-26, 2009 at the Technical University of Denmark in Lyngby and are supported by the Centre for Electronic Corrosion (CELCORR) and ATV-SEMAPP at the Technical University of Denmark.
Industry News | 2010-04-16 02:06:28.0
Minneapolis, MN - SMTA and CALCE are pleased to announce that the program for the Symposium on Counterfeit Electronic Parts West is finalized and available on-line at www.smta.org/counterfeit and registration is open. The event will take place June 8-11, 2010, in Deer Valley (Phoenix), AZ.
Industry News | 2010-10-08 00:19:16.0
SMTA and CALCE are pleased to announce that the program for the Counterfeit Electronic Parts and Electronic Supply Chain Symposium is finalized and available on-line at www.smta.org/counterfeit and registration is open. The event will take place November 30 to December 2, 2010, at the University of Maryland in College Park, MD.
Industry News | 2010-11-17 12:31:49.0
SMTA and CALCE are pleased to announce that Andrew Kline, Senior Advisor for Intellectual Property Enforcement, Executive Office of the President, will give a keynote address on Wednesday, December 1, 2010 for the Counterfeit Electronic Parts and Electronic Supply Chain Symposium. The event will take place November 30 to December 2, 2010, at the University of Maryland in College Park, MD.
Industry News | 2011-05-19 22:22:31.0
SMTA and CALCE are pleased to announce that the program for the Counterfeit Electronic Parts and Electronic Supply Chain Symposium is finalized and available on-line at http://www.smta.org/counterfeit and registration is open. The event will take place June 28 - 30, 2011 in College Park, MD.
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