Industry Directory | Consultant / Service Provider / Manufacturer
Vigilant Components is an independent, specialist electronic components sourcing company, offering high integrity component sourcing, component testing, component verification.
Industry Directory | Consultant / Service Provider / Manufacturer
Waffletechnology� (patent pending) cleaning cards dramatically outperform normal flat cleaning cards.
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Electronics Forum | Fri Sep 18 12:21:03 EDT 2009 | kennyg
Does anyone have any off-the-shelf tool for measuring air gaps under components? Specifically to measure if a part is raised beyond special specifications, such as determining if a leaded connector is raised beyond 5, 10 or 20 mils from the PCB surf
Electronics Forum | Fri Sep 18 13:23:16 EDT 2009 | fredcalkins
There may be other solutions to this, but MSC Industrial Supply has a plastic shim assortment that may work for you. Part number 00019208 for $35.54 the assortment has 12 different sizes to .02 inches. The shims are flexible and can be trimmed to any
Used SMT Equipment | Pick and Place/Feeders
Product number: RX - 6 Detailed product introduction Characteristic： With high productivity, versatility, highquality new modular placement machine RX - 6 listed Draw/monitor corresponding patch Components in speed Chip components: 42000 CPH *
Used SMT Equipment | SMT Equipment
Product name: RX - 6 high-speed module chip mounter Product number: RX - 6 Detailed product introduction Characteristic： With high productivity, versatility, high quality new modular placement machine RX - 6 listed Draw/monitor corresponding p
Industry News | 2003-06-13 09:56:46.0
Wire and spring specialist William Hughes can now offer three different versions of its PCB test point - small, large and long-legged in quantities suitable for prototype work or volume production.
Industry News | 2003-04-22 08:01:54.0
Two new additions to Heyco's range of PCB accessories are the SHCBS and SRF series of nylon circuit board spacers which, when used as a pair, provide a secure hinging mechanism for a mounted PCB.
Parts & Supplies | Chipshooters / Chip Mounters
Below universal auto insertion parts are Manufactured in China,so no need to describe too much about price,what's the difference is that you will surely like it when you try them on machines,just based on the proved quality,please contact louis@smt-m
Technical Library | 2023-06-12 19:00:21.0
The SMT print process is now very mature and well understood. However as consumers continually push for new electronic products, with increased functionality and smaller form factor, the boundaries of the whole assembly process are continually being challenged. Miniaturisation raises a number of issues for the stencil printing process. How small can we print? What are the tightest pitches? Can we print small deposits next too large for high mix technology assemblies? How closely can we place components for high density products? ...And then on top of this, how can we satisfy some of the cost pressures through the whole supply chain and improve yield in the production process! Today we are operating close to the limits of the stencil printing process. The area ratio rule (the relationship between stencil aperture opening and aperture surface area) fundamentally dictates what can and cannot be achieved in a print process. For next generation components and assembly processes these established rules need to be broken! New stencil printing techniques are becoming available which address some of these challenges. Active squeegees have been shown to push area ratio limits to new boundaries, permitting printing for next generation 0.3CSP technology. Results also indicate there are potential yield benefits for today's leading edge components as well. Stencil coatings are also showing promise. In tests performed to date it is becoming apparent that certain coatings can provide higher yield processing by extending the number of prints that can be performed in-between stencil cleans during a print process. Preliminary test results relating to the stencil coating technology and how they impact miniaturisation and high yield processing will be presented.
Technical Library | 2019-09-11 23:33:04.0
There are numerous techniques to singulate printed circuit boards after assembly including break-out, routing, wheel cutting and now laser cutting. Lasers have several desirable advantages such as very narrow kerf widths as well as virtually no dust, no mechanical stress, visual pattern recognition and fast set-up changes. The very narrow kerf width resulting from laser ablation and the very tight tolerance of the cutting path placement allows for more usable space on the panel. However, the energy used in the laser cutting process can also create unwanted products on the cut walls as a result of the direct laser ablation. The question raised often is: What are these products, and how far can the creation of such products be mitigated through variation of the laser cutting process, laser parameters and material handling? This paper discusses the type and quantity of the products found on sidewalls of laser depaneled circuit boards and it quantifies the results through measurements of breakdown voltage, as well as electrical impedance. Further this paper discusses mitigation strategies to prevent or limit the amount of change in surface quality as a result of the laser cutting process. Depending on the final application of the circuit board it may prompt a need for proper specification of the expected results in terms of cut surface quality. This in turn will impact the placement of runs and components during layout. It will assist designers and engineers in defining these parameters sufficiently in order to have a predictable quality of the circuit boards after depaneling.
www.unisoft-cim.com/solder.htm - The ProntoSELECTIVE-SOLDERING module from Unisoft is used by electronics manufacturers to generate the necessary programs for automatic PCB Selective Soldering machines in minutes. ProntoSELECTIVE-SOLDERING helps prog
Depanelizing skip routed PCB panels up to 48" long is made simple and easy with FKN Systek’s K4000 PCB singulator. Just place the bottom scoreline of the PCB onto the linear blade and step on a guarded foot switch to bring the circular blade across t
Career Center | San Jose, California USA | Research and Development
Join this team focused on RF Modules for the rapidly expanding Cellular and Wireless Data markets. You will be part of the Packaging and Assembly team, and support multiple R&D design teams within the Wireless Semiconductor Division (WSD) of Avago T
Career Center | Exton, Pennsylvania USA | Production
Job Description: +Program and effectively operate Surface Mount Technology equipment. +Run usage and failure reports on each work order. +Maintain trouble shooting log. +Check machinary often so it can be and is operated in a safe manner. +
Career Center | BANGALORE, Karnataka India | Quality Control
New Model Evaluation • Testing & Evaluation of New TV models as per the relavant standards & release the defect free product for Mass Production • Measurement of audio parameters like Max out put, distotion, S/N ratio, hum, buzz etc • To conduct aud
Career Center | bangalore, India | Management
• Hands on experience in planning functions i.e. material planning, scheduling, inventory management. • We have a good knowledge of BOM, KANBAN, MIN-MAX order quantity, • We have Good knowledge in ERP Baan System , • Demand adjustment as per cu
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/our-company/news-room/feature-content-roll-up-page/interactive-our-time-to-give-campaign-raised-nearly-1-million
Interactive - Our Time to Give Campaign Raised Nearly $1 Million Nordson Corporation Global Directory | Languages NASDAQ $219.43 -3.59 Our Products Our Industries Our Applications Brands
| https://www.eptac.com/faqs/ask-helena-leo/ask/bottom-termination-parts
. Do you know the bow specification of IPC 7093, section 5.2.6 on max warp this part should be? Answer: This question raised is knowing what the bow specification of IPC-7093, section 5.2.6 is all about. First
