Industry Directory | Manufacturer
Michmas Electronics Ltd. provides comprehensive electronic circuit and assembly solutions. From prototyping to full-scale production, we handle project management, PCB production, component procurement, and circuit assembly
Industry Directory | Distributor / Manufacturer's Representative
Grip Technologies manufactures all forms of component processing equipment.
Form & Cut 2-, 3-, 4-, 5-, and 7-leaded Radial Components Capable of forming loose radial components at rates up to 5,000 parts per hour with a variable speed motor. Feed components by hand or with tubes (TO-220s) Reduce setup time with quick ch
The CF-9 Radial Lead Former forms and cuts 2- and 3-leaded taped radial components such as TO-92s, capacitors, transistors, LEDs, etc. - precisely and repeatedly, in standard and special forms. This machine is capable of forming and cutting up to 25
Used SMT Equipment | Flexible Mounters
Product Name: Samsung DECN-S2 chip mounter Product number: Samsung DECN-S2 Detailed product introduction In order to improve production capacity, the transmission path of PCB is optimized. Modular track I believe through the module type track ca
Used SMT Equipment | SMT Equipment
Product Name: Samsung DECN-S2 chip mounter Product number: Samsung DECN-S2 Detailed product introduction In order to improve production capacity, the transmission path of PCB is optimized. Modular track I believe through the module type track ca
Industry News | 2018-08-17 10:22:44.0
New Component ID Poster for electronics training and certification.
Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2007-03-28 10:18:33.0
Legislation against the use of lead in electronics has been the driving force behind the use of lead-free solders, surface finishes, and component lead finishes. The major concern in using lead-free solders in the assembly and rework Chip Scale Packages (CSPs) is the relatively high temperatures that the components and the boards experience. Fine-pitch CSPs have very low standoff heights following assembly making inspection and rework of these components more difficult. One other concern pertinent to rework is the temperature of the neighboring components during rework. These issues, coupled with the limitations of rework equipment to handle lead-free reflow temperatures, make the task of reworking lead-free assemblies more challenging.
The CF-9 Radial Lead Former forms and cuts 2- and 3-leaded taped radial components such as TO-92s, capacitors, transistors, LEDs, etc. - precisely and repeatedly, in standard and special forms. This machine is capable of forming and cutting up to 25
Events Calendar | Tue Jul 02 18:30:00 UTC 2024 - Tue Jul 02 18:30:00 UTC 2024 | ,
Europe Chapter Webinar: "Back-to-Basics" SMT Assembly
Career Center | South Plainfield, New Jersey USA | Engineering
MacDermid Alpha Electronics Solutions, a world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places, is seeking a Jr. Chemical Process Enginee
Career Center | TULSA, Oklahoma USA | Engineering,Production,Purchasing,Research and Development
This opportunity is with a global industry leader designing and manufacturing sophisticated electronic assemblies and sub-assemblies. These products play a very significant role throughout the world providing essential equipment and components to the
Career Center | Boise, Idaho USA | Engineering,Research and Development
Sr. Microelectronics Development Engineer Over 20 years experience in SMT Process Development for large Contract Manufacturer. Specialist in Stencil Printing, Component Placement, Dispense, Reflow, Rework, RoHS Processes, Material and Equipment Quali
Career Center | Moscow, Russia | Engineering,Management,Production,Quality Control
04.2011 - continue to work Moscow, - Instrumentation / electronics engineering procurement and contract manufacturing Supply production of components and materials. Placing orders for contract manufacturing of electronic products. Coordination of
Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes by: Cheryl Tulkoff, Greg
Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes Leadless, near chip scale
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/industrial-coating-systems/additional-product-sub-type/plural-component-systems?con=t&page=26
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PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic1028&OB=ASC.html
Lead Frame Chip Scale Packages - PCB Libraries Forum Forum Home > PCB Footprint Expert > Questions & Answers New Posts FAQ Search Events Register Login Lead Frame Chip Scale Packages
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