Industry Directory | Equipment Dealer / Broker / Auctions
Component Central Inc. is a full service component and equipment broker, from as-is through fully reconditioned equipment.
Industry Directory | Consultant / Service Provider
Winslow Automation has been advancing lead finish and soldering technology for the military and aeropace, telecommunications, medical, and consumer electronics industry since its inception in 1986.
New Equipment | Test Equipment - Bond Testers
For Wire and Die Testing on Royce and Dage tester
The HEPCO Model T3700-2 is a Heavy-Duty Shear Machine for the majority of radial-leaded components, including connectors, transistors, coils, trimpots, DIP ICs and capacitors. The steel frame and stainless steel cylinder, coupled with the high-flow
Electronics Forum | Mon May 22 10:41:50 EDT 2000 | Scott G
Can anybody provide information on shear testing of passive components. What standards are used etc. Thanks
Electronics Forum | Tue May 23 20:39:37 EDT 2000 | Dave F
Scott: Sounds like fun: � Solder joint strength in pull/shear varies with lead geometry, solder volume, lead metal/metallization, and the test method. � Among things, IPC-TM-650 talks to getting pads off-of boards. For instance: Method 2.4.8 is for
Used SMT Equipment | Other Equipment
Wanted, Hepco T3700 Radial Component Lead Shear prep machine. Thanks Ed
Used SMT Equipment | Circuit Board Assembly Products
The product introduction The SM-2009 scissors & pneumatic type separator, we use the most advanced non-stress idea to designed it, it’s help to prevent the chap phenomena as the PCB separated by the general separator, it’s improve the PCB’s quality
Industry News | 2022-01-10 16:55:15.0
The SMTA Capital Chapter Officer team is excited to provide our members with a free technical webinar on "Use of Photonic Soldering to Rework Chip Components" presented by Dr. Vahid Akhavan, Global Application Engineer at NovaCentrix. The presentation will take place on January 20th at 12:00am EST.
Industry News | 2022-05-05 17:28:46.0
Includes new, easy-to-operate pail pump with unique pail change and loading method, which also reduces material waste
Parts & Supplies | SMT Equipment
Smt component inserter Universal AI Parts 44624204 Universal AI Part Number: N210044355AA PUSHER 104691107205 CHUCK 1087188201 80013805 51119302 51109602 47630915 Centering Insert 47152202 FINGER 46930412 GUIDE JAW 46914201 ACTUATOR 4691
Parts & Supplies | SMT Equipment
Smt component inserter Universal AI Parts 44426606 Universal AI Part Number: N210044355AA PUSHER 104691107205 CHUCK 1087188201 80013805 51119302 51109602 47630915 Centering Insert 47152202 FINGER 46930412 GUIDE JAW 46914201 ACTUATOR 4691
Technical Library | 2020-12-24 02:50:56.0
A method for packaging integrated circuit silicon die in thin flexible circuits has been investigated that enables circuits to be subsequently integrated within textile yarns. This paper presents an investigation into the required materials and component dimensions in order to maximize the reliability of the packaging method. Two die sizes of 3.5 mm×8 mm× 0.53 mm and 2 mm×2 mm×0.1 mm have been simulated and evaluated experimentally under shear load and during bending. The shear and bending experimental results show good agreement with the simulation results and verify the simulated optimal thickness of the adhesive layer. Three underfill adhesives (EP30AO, EP37-3FLF, and Epo-Tek 301 2fl), three highly flexible adhesives (Loctite 4860, Loctite 480, and Loctite 4902), and three substrates (Kapton,Mylar, and PEEK) have been evaluated, and the optimal thickness of each is found. The Kapton substrate, together with the EP37-3FLF adhesive, was identified as the best materials combination with the optimum underfill and substrate thickness identified as 0.05 mm.
Technical Library | 2016-01-12 11:01:25.0
More and more Land Grid Array (LGA) components are being used in electronic devices such as smartphones, tablets and computers. In order to enhance LGA mechanical strength and reliability, capillary flow underfill is used to improve reliability. However, due to the small gap, it is difficult for capillary underfill to flow into the LGA at SMT level. Due to cost considerations, there are usually no pre-heating underfill or cleaning flux residue processes at the SMT assembly line. YINCAE solder joint encapsulant SMT256 has been successfully used with solder paste for LGA assembly. Solder joint encapsulant is used in in-line LGA soldering process with enhanced reliability. It eliminates the underfilling process and provides excellent reworkability. The shear st rength of solder joint is stronger than that of underfilled components. The thermal cycling performance using solder joint encapsulant is much better than that using underfill. Bottom IC of POP has been studied for further understanding of LGA assembly process parameters. All details such as assembly process, drop test and thermal cycling test will be discussed in this paper.
Separate precise SMD thin board, aluminum PCB, for special board , needs customization. If any question, just feel free to contact bella@qy-smt.com and browse Website?https://morel-equipment.com/
Suitable for diversified glass fibre board, FR-4 board, aluminum board, etc, especially for the PCB with components on both sides. If you have any question about the machine, please feel free to contact e-mial : bella@qy-smt.com
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Career Center | Milpitas, California USA | Engineering,Production,Quality Control,Research and Development,Technical Support
Winslow Automation, Inc. (aka Six Sigma), an industry leader in electronic component interconnect technology & related test and failure analysis services, is seeking individuals specializing in materials lab testing to join our team. We have openin
Career Center | Milpitas, California USA | Clerical,Production,Quality Control,Research and Development,Technical Support
Winslow Automation, Inc. (aka Six Sigma), an industry leader in electronic component interconnect technology & related test and failure analysis services, is seeking a ‘hands on’ Materials Engineer to join our Test services team. This individual wi
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
SMTnet Express July 11, 2013, Subscribers: 26149, Members: Companies: 13418, Users: 34911 Effect of BGA Reballing and its Influence on Ball Shear Strength by S. Manian Ramkumar Ph.D., Andrew J. Daya, Daniel B. Lewanda; Rochester Institute
Effect of Reflow Profile on SnPb and SnAgCu Solder Joint Shear Force News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! Effect of Reflow Profile on SnPb and SnAgCu Solder
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/44241611-block-shear-188956?page=149&order=name+asc
> UNIVERSAL BLOCK SHEAR 44241611 | QYSMT,smt spare parts, ai spare parts, component insertion machine, smd feeder, smt feeder, smt nozzle, smd parts, juki nozzle, smt parts, 44241611,High-quality AI spare parts supplier, Panasonic
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SolderTips: Defining Shear Forces for Surface Mounted Components | EPTAC Skip to content Scroll Toll Free: 800.643.7822 Toggle navigation Training All Classes
