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Seika Machinery Picks up Two NPI Awards during APEX

Industry News | 2016-03-15 16:08:12.0

Seika Machinery announces that it was awarded two 2016 NPI Awards during a Tuesday, March 15, 2016 ceremony that took place at the Las Vegas Convention Center during the IPC APEX EXPO. Seika won for the following categories: Cleaning equipment for the Unitech UC-250M-CV Board Cleaner and Process Control Tools for the Malcomtech RCX Series Modular Reflow Oven Profiling System.

Seika Machinery, Inc.

Juki to Participate in PoP Center during SMTA International

Industry News | 2012-09-10 10:44:36.0

Juki Automation Systems, will participate in the Package-on-Package (PoP) Design and Assembly Center during the annual SMTA International conference, scheduled to take place October 14-18, 2012 in Orlando, FL.

Juki Automation Systems

Seika Recognizes Top Performing McDry Reps during APEX

Industry News | 2017-02-23 14:07:15.0

Seika Machinery is pleased to announce its top McDry representatives for 2016. The top three reps were recognized during the recent IPC APEX EXPO in San Diego.

Seika Machinery, Inc.

Juki’s Gerry Padnos to Present during IPC APEX EXPO 2011

Industry News | 2011-03-15 20:26:24.0

Juki Corporation, a world-leading provider of automated assembly products and systems, announces that Gerry Padnos, Director of Technology, will present a paper titled "Improving Efficiency with Root Cause Failure Analysis" at the upcoming IPC APEX EXPO.

Juki Automation Systems

How to Prevent the Tombstone and Open Defects during the SMT Reflow Process

Industry News | 2018-10-18 08:14:11.0

How to Prevent the Tombstone and Open Defects during the SMT Reflow Process

Flason Electronic Co.,limited

How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process

Industry News | 2018-10-18 08:32:52.0

How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process

Flason Electronic Co.,limited

Ersa to Present on Void Reduction in Reflow Soldering during SMTAI

Industry News | 2016-09-07 19:04:13.0

Kurtz Ersa North America is pleased to announce that Viktoria Rawinski, Assistant to the CEO of the Kurtz Ersa Group and head of the Kurtz Ersa Company Museum and the Corporate History Department, will present the paper entitled, “Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate – Process Integration in Industrial Production,” during SMTA International. The presentation is scheduled to take place during Session MFX4, entitled, “Reflow and Soldering Technology: Void Reduction” on Wednesday, September 28, 2016 from 10:30 a.m. to 12 p.m. in Room 49.

kurtz ersa Corporation

KIC to Participate in Process Advice and Defect Clinic during Productronica 2007

Industry News | 2007-10-12 09:43:21.0

San Diego � October 10, 2007 � KIC, the leader of thermal process development and control products, and winner of multiple industry awards, announces that it will be one of four sponsors at the Productronica 2007 special feature �Process Advice and Defect Clinic� sponsored by renowned industry expert Bob Willis. Marybeth Allen will represent KIC during the process clinic.

KIC Thermal

Ersa to Offer Demos in Interactive Virtual Showrooms during APEX Virtual EXPO

Industry News | 2021-02-12 16:18:20.0

Kurtz Ersa Inc. today announced plans to participate in the 2021 IPC APEX Virtual EXPO, scheduled to take place March 9-11, 2021 online at www.ipcapexexpo.org. Ersa has upgraded its demo/application centers to interactive virtual showrooms where the team will give customers in depth and personalized equipment demonstrations for wave soldering, reflow soldering, selective soldering, rework equipment, I4.0 connectivity and more. The company will highlight the EXOS 10/26, Ersa VERSAEYE and and HR 600 XL during the virtual event.

kurtz ersa Corporation

Dr. Mike Bixenman to Teach a Workshop on Reliability, Contamination, Cleaning and Process Control during SMTAi

Industry News | 2017-09-05 14:08:01.0

KYZEN is pleased to announce that Dr. Mike Bixenman will conduct a special workshop during the SMTA International Technical Conference, scheduled to take place Sept. 17-21, 2017 at the Donald E. Stephens Convention Center in Rosemont, IL. The workshop, entitled “Characterization of Soldering Materials, Contaminants, Cleaning Processes and Process Control for Building Reliable Electronic Assemblies,” is scheduled to take place Monday, Sept. 18 from 1:30-5 p.m.

KYZEN Corporation


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