New Equipment | Board Handling - Pallets,Carriers,Fixtures
The award winning KIC profilers provide accurate and quick profiling, as well as optimum oven set up. Facilitates Reflow Profiling Works on Edge Conveyors with and without Center Board Support Profile Low Clearance Ovens Accomodates Extra Wide
Ideal for in-house Rapid PCB Prototyping The ProtoFlow S is LPKF's premiere convection oven, ideal for lead-free reflow soldering, meeting the stringent demands of rapid PCB soldering applications. The ProtoFlow S features even heat distribution, e
Overview of PRO 1600 Forced Convection Reflow Oven in operation. Features include small footprint (31" x 31"), lead free reflow capable, and precise software process control.
PRO 1600 is a full forced air / nitrogen convection reflow oven that covers only 31" x 31" of floor space. It has been designed for reflow soldering of even the most challenging applications including, high thermal mass and lead free assemblies. PRO
http://yincae.com/index.html YINCAE SMT 256 Dipping Process YINCAE SMT 266 Jetting Process
New Equipment | Board Handling - Storage
Prevent your components from micro-cracking during reflow with proper Ultra-Low Humidity Storage. DXU models of maintain1%RH Wide range of cabinets including UL/C models Conforms to IPC/JEDEC J-STD 033B.1 Dehumidifies ICs to prevent micro-crack
Technical Library | 2016-11-30 21:30:50.0
Mid-chip solder balling is a defect typically associated with solder paste exhibiting poor hot slump and/or insufficient wetting during the reflow soldering process, resulting in paste flowing under the component or onto the solder resist. Once molten, this solder is compressed and forced to the side of the component, causing mid-chip solder balling.This paper documents the experimental work performed to further understand the impact on mid-chip solder balling from both the manufacturing process and the flux chemistry.
The OvenWATCH® system is designed to continuously monitor the quality of PCB assemblies as they pass through your reflow ovens. Now the OvenWATCH® system can provide you and your customers with the confidence of knowing that the quality assurance of
Overview of PRO 1600 Forced Convection Reflow Oven in operation. Features include small footprint (31" x 31"), lead free reflow capable, and precise software process control.
AOI technology has been proven as highly efficient for PCB manufacturing process improvement and quality achievement. EKT strives to be your most reliable AOI supplier. cathysun@ekt-tech.com mb/wechat: +86-18320811289
