Full Site - : component spacing (Page 23 of 203)

Ball Grid Array (BGA) Package

Industry News | 2018-12-08 03:31:22.0

Ball Grid Array (BGA) Package

Flason Electronic Co.,limited

Adhesive Backed Plastic Stencils vs Mini Metal Stencils

Technical Library | 2015-08-27 15:32:16.0

Ever since there has been a widespread usage of surface mount parts, the trend of continued shrinkage of devices with ever finer pitches has continued to challenge PCB assemblers for the rework of same. Todays' pitches are commonly 0.5 to 0.4mm with packages of tiny outline sizes, 5 -10mm square, making the rework of such devices a challenge. In addition to the handling and inspection challenges comes the board density. Spacing to neighboring components continues to be compressed so the rework techniques should not damage neighboring components.

BEST Inc.

HeatShieldGel(TM)

HeatShieldGel(TM)

Videos

To order, visit http://www.solder.net/products/heatshieldgel-tm/ BEST HeatShield Gel™ is a thermal shield water-based gel designed to be used in the PCB rework/repair or board assembly areas in order to provide thermal protection of electronic compo

BEST Inc.

HeatShieldGel™ - Thermal Protection of Electronic Components During Reflow

HeatShieldGel™ - Thermal Protection of Electronic Components During Reflow

New Equipment | Rework & Repair Equipment

BEST HeatShield Gel™ is a thermal shield water-based gel designed to be used in the PCB rework/repair or board assembly areas in order to provide thermal protection of electronic components. It is truly a revolutionary means to protect components. It

BEST Inc.

Award for New Product Innovation Announced

Industry News | 2016-04-20 10:27:40.0

BEST, Inc. was presented Circuit Assembly’s NPI Award for its HeatShield Gel™ high temperature shielding product at the IPC APEX Expo on Feb. 24 in San Diego, Calif.

BEST Inc.

BEST Developes Revolutionary Gel for Masking of Parts

Industry News | 2016-01-05 16:10:10.0

Novel method for protecting electronic components from heat.

BEST Inc.

SMT Foil Stencils

SMT Foil Stencils

New Equipment | Solder Paste Stencils

SMT Foil Stencils are laser cut solder paste stencils designed to work on their own for hand printing or with stencil tensioning systems. These laser cut stencils do not need to be permanently glued in a frame. These so-called frameless stencils are

BEST Inc.

This video describes the IPC A-600 training and certification program.

This video describes the IPC A-600 training and certification program.

Videos

This video describes the IPC A-600 training and certification program. The IPC A-600 specification is a set of acceptability specifications for printed circuit boards. These standards determine the acceptance and reject criteria for printed wiring bo

BEST Inc.

This video describes the IPC A-600 training and certification program.

This video describes the IPC A-600 training and certification program.

Videos

This video describes the IPC A-600 training and certification program. The IPC A-600 specification is a set of acceptability specifications for printed circuit boards. These standards determine the acceptance and reject criteria for printed wiring bo

BEST Inc.

This video describes the IPC A-600 training and certification program.

This video describes the IPC A-600 training and certification program.

Videos

This video describes the IPC A-600 training and certification program. The IPC A-600 specification is a set of acceptability specifications for printed circuit boards. These standards determine the acceptance and reject criteria for printed wiring bo

BEST Inc.


component spacing searches for Companies, Equipment, Machines, Suppliers & Information

Global manufacturing solutions provider

World's Best Reflow Oven Customizable for Unique Applications
Circuit Board, PCB Assembly & electronics manufacturing service provider

High Precision Fluid Dispensers
PCB Handling with CE

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
High Throughput Reflow Oven

Best Reflow Oven