FKN Systek K7000 - Compact PCB Singulator for Close Component Spacing K7000 Singulates panels with components up to .030" apart. Blades Made of Long Lasting High Speed Steel. Linear Blade 12" (305mm) long. Front and Back adjustable work table.
Technical Library | 2019-05-31 14:21:59.0
Microelectronics is the manufacture of systems built from extremely small electronic components. In today’s electronic world, devices must be portable, equipped with wireless technology and are driven by size, weight, power, and cost (SWaP-C). These system level drivers are crucial to all current and future electronic applications from personal computers and cellular telephones to military-fielded hardware, biomedical instrumentation, and space-flight hardware.
Used SMT Equipment | Pick and Place/Feeders
RS-1 Board Size max. 650 mm × 370 mm (single clamping) max. 950 mm × 370 mm (double clamping) max. 1,200 mm × 370 mm (double clamping)*1 Component Height 25 mm Component Size 0201*2 (metrisch) ~ 74 mm / 50 × 150
Nordson ASYMTEK's Panorama S-Line delivers conformal coating process control in a compact footprint – with overlapping line processes that minimize manufacturing floor space use up to 50%.
XT Series electrode humidifiers provide humidification for a wide range of buildings, including health care, commercial, industrial, and government facilities. Easy installation and cylinder replacement together with minimal maintenance make XT Serie
Electronic displays refers to information display devices that use electronic technology to transform imperceptible signals into perceptible signals. Their characteristics include small-space occupancy, flexible display format, and simultaneously dis
Electronic displays refers to information display devices that use electronic technology to transform imperceptible signals into perceptible signals. Their characteristics include small-space occupancy, flexible display format, and simultaneously dis
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
FKN Systek K2000 - Reduce scrap due to board handling Issues Economical Manual and Motorized Depaneling of Pre-scored PCBs Blades Made of Long Lasting High Speed Steel.. Singulate Panels with Components up to 2.5" Adjustable front blade guard
The MPM® Momentum® II BTB™ (Back to Back) configurable stencil printer allows dual-lane processing for higher throughput but without increasing either line length or capital investment. The Momentum II BTB stencil printer is t
