Industry Directory | Manufacturer
Micross Components is a leading global provider of specialty electronics solutions for defense, space, medical and demanding industrial industries. -
Industry Directory | Consultant / Service Provider
CCI is a highly recognized Electronic Test Laboratory that specializes in all types of component testing and services. Primarily Up-Screening, Characterization, Qualification, DPA, HSD and Tape & Reel
Simplify Dispensing with GPD Global’s Island Series Dispense Platforms Island Series robots give you versatility to do simple, repetitive automation jobs. Work areas range from 300 mm x 400 mm to 400 mm x 400 mm. All Island Series robots are compati
FKN Systek K7000 - Compact PCB Singulator for Close Component Spacing K7000 Singulates panels with components up to .030" apart. Blades Made of Long Lasting High Speed Steel. Linear Blade 12" (305mm) long. Front and Back adjustable work table.
Electronics Forum | Thu Nov 11 19:23:33 EST 1999 | Dave F
Gary: Sounds like the spacing between each pad for the component are too far apart. My 2�. Dave F
Electronics Forum | Wed Aug 28 19:35:13 EDT 2002 | ppwlee
Hi, Does anyone have guidelines on minimum SMT component spacing for bottom sided wave soldering? I am looking for general rule of thumb in wave soldering bottom side SOTs, 0805 & 0603s. How about minimum through-hole lead to pad distance? Peter
Used SMT Equipment | Pick and Place/Feeders
Product number: RX - 7 Detailed product introduction Characteristic With high productivity, versatility, highquality new modular placement machine RX 7 listed Component placement speed (best conditions): 75000 CPH chip components Element size: 0
Used SMT Equipment | SMT Equipment
Product name: RX 7 high-speed module chip mounter Product number: RX - 7 Detailed product introduction Characteristic With high productivity, versatility, high quality new modular placement machine RX 7 listed Component placement speed (best con
Industry News | 2003-03-24 09:46:41.0
Will feature a number of new technologies of interest to fabricators in printed circuit materials, laminate materials, polymer thick films and, most notably, its newest product line of embedded passive materials, DuPont Interra�.
Industry News | 2003-04-28 07:47:37.0
DPAC exceeds requirements of Sarbanes-Oxley Act in independence and financial expertise for the DPAC Technologies Board
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Parts & Supplies | Assembly Accessories
Samsung CP 8x2mm feeder for 0201 component More Samsung feeder parts in stock 125X40X133MM Samaung Thimble 300X56X66MM Samaung Soft Thimble Pin J1301023 Samaung Feeder Snap spring J7066039A Samaung Feeder Spring J8100123A Samaung CP45 8X4 Fee
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Parts & Supplies | Pick and Place/Feeders
Samsung CP 8x2mm new feeder(0201) More Samsung feeder parts in stock 125X40X133MM Samaung Thimble 300X56X66MM Samaung Soft Thimble Pin J1301023 Samaung Feeder Snap spring J7066039A Samaung Feeder Spring J8100123A Samaung CP45 8X4 Feeder upper
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Technical Library | 2015-08-27 15:32:16.0
Ever since there has been a widespread usage of surface mount parts, the trend of continued shrinkage of devices with ever finer pitches has continued to challenge PCB assemblers for the rework of same. Todays' pitches are commonly 0.5 to 0.4mm with packages of tiny outline sizes, 5 -10mm square, making the rework of such devices a challenge. In addition to the handling and inspection challenges comes the board density. Spacing to neighboring components continues to be compressed so the rework techniques should not damage neighboring components.
Web:https://www.ascen.ltd/component_tape_feeder/ ,Robotic component tube feeder|SMT part tube feeder is a SMT taped stick tube feeder and developed for the customer required and that is not a standard machine.tube radial component feeder can output t
Web:https://www.ascen.ltd/component_tape_feeder/ ,Robotic component tube feeder|SMT part tube feeder is a SMT taped stick tube feeder and developed for the customer required and that is not a standard machine.tube radial component feeder can output t
Training Courses | | | IPC J-STD-001 Space Specialist (CIS)
The J-STD-001 Space Addendum is an additional optional module for the Certified IPC J-STD-001 CIS (Specialist) program for organizations that are required to meet these additional requirements.
Training Courses | | | IPC-600 Specialist (CIS)
The Certified IPC-600 Specialist (CIS) training targets quality assurance and acceptance of bare printed circuit boards.
Events Calendar | Mon Mar 18 00:00:00 EDT 2019 - Mon Mar 18 00:00:00 EDT 2019 | ,
Webinar: Stencil Design for Solder Paste, In Process Inspection & Process Defects
Events Calendar | Thu Jun 13 00:00:00 EDT 2024 - Thu Jun 13 00:00:00 EDT 2024 | Melbourne, Florida USA
Space Coast Event: Maximizing Automation Efficiency: Are You Making the Most of Your Investment?
Career Center | Littleton, Colorado USA | Engineering
If you have experience in Satellite Communications or RF Payload Engineering we have advancement opportunities that may be of interest to you. Available positions are in disciplines such as: Shaped Reflector design and analysis Antenna compo
Career Center | Eden Prairie, Minnesota USA | Production
Solderer ALL SHIFTS Logic PD collaborates with clients to help them launch products that accelerate growth and capture value in the Internet of Things (IoT). Logic PD helps at any stage in the product lifecycle by being the complete product innovat
Career Center | Wesley Chapel, Florida USA | Engineering,Management,Quality Control
15 years of experience on Electronic Manufacturing. Certified SMT Process Engineer TQM Knowledge Statistics DOE Screen Printer Thermal Process Knowledge JIT International Project Engineering Experience
Career Center | , Portugal | Engineering,Maintenance,Production,Quality Control,Technical Support
SMT Process engineer Quality Efficiency Continuous improvement 11 years of experience in high volume production in a Japanese corporation Expertise in: Solder paste printing (DEK, Panasonic) Adhesive dispensing (FUJI, Panasonic) Components Pick and p
SMTnet Express, March 12, 2015, Subscribers: 22,490, Members: Companies: 14,252 , Users: 37,867 Miniaturization with Help of Reduced Component to Component Spacing Jonas Sjoberg, Ranilo Aranda, David Geiger, Anwar Mohammed, Murad Kurwa
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/pdf-print-output-feature_topic760_post2708.html
. Then you insert the component package outline around (or inside the hole pattern) and save to a PKG file format. The hole locations can be on many different grid spacings and various hole sizes and plating options
GPD Global | https://www.gpd-global.com/co_website/pdf/lead-former/CF9-User-Guide-901-1-07.pdf
hole-to-hole spacings. • Controls accuracy and repeatability through the use of a solid gear train, cam, and cam follower indexing system. Most cutting and forming needs are covered with the standard dies we offer. Several of the most common component
