Overview • 10 times faster compared to standard 8051 • Interface for additional Special Function Registers • Pipelined RISC architecture The DP80C51 is an ultra high performance, speed optimized soft core, of a single-chip 8-bit embedded controll
Electronics Forum | Mon Jan 29 06:44:59 EST 2001 | Scott B
I have recently come across a device which has a palladium over nickel finish which when soldered shows evidence of poor wetting to the lead ( i.e. a wetting angle greater than 90�) about three quarters of the way up the side of lead. This is only vi
Electronics Forum | Mon Apr 04 09:35:16 EDT 2005 | russ
What are the max temp specs for each of the components? this sounds like the real problem with lead free conversion. Which parts are which? Currently we are getting ready to reball lead free BGAs back to lead for a customer that had to be lead free
Industry News | 2013-05-14 12:32:32.0
The Coalition for the Advancement of MicroElectronic Systems Technology (CAMEST),will hold its initial planning meeting and charter development May 21 during the IPC Electronic Systems Technologies Conference (IPC ESTC) at The New Tropicana in Las Vegas.
Industry News | 2003-04-15 08:23:22.0
Metral TINT back panel receptacles are compatible with standard pin-in-paste SMT processes, eliminating costly secondary assembly operations including heat staking, wave soldering or press fitting.
Component Shortages Causing Electronics Manufacturers to Use All Means Necessary to Ship Products Component Shortages Causing Electronics Manufacturers to Use All Means Necessary to Ship Products As the electronics manufacturing and assembly
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/offset-defined-in-padstack-to-match-corporate-grid_topic2726_post11061.html
. Unless you have someone to validate component attachment integrity on board from what it's define on spec sheets or calculators I'm not recommending it
