Industry Directory | Consultant / Service Provider
Provides strain gage bonding service, calibration and data acquisition service for pc board strain measurement
Industry Directory | Consultant / Service Provider / Manufacturer
European Company based in China. Specialised in Electronics(PCBA's,Lighting,Cables, Solar). Quality and competitive prices!
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Strain gage testing is utilized to evaluate materials and processes effect on PWB and component-level stress due to static and dynamic loads. These stresses can originate from sources such as thermal, mechanical, and/or a combination of the two. STI
Electronics Forum | Thu Jul 31 08:20:06 EDT 2008 | davef
Not quite what you'ree looking for, but may be interesting: JESD22B113, Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of Components for Handheld Electronic Products http://www.akrometrix.com/industrydocs/JESD22B113
Electronics Forum | Mon May 10 15:02:37 EDT 2004 | davef
There's no such specification. Not should there be. Shear tests [in our opinion] are senseless, because: * Solder joint strength in pull/shear varies with lead geometry, solder volume, lead metal/metallization, and the way the test is done. * She
Used SMT Equipment | Depanelizers / Routers
Details: Cab Maestro 2M PCB Separator, Motorized Model: Maestro 2M MAESTRO 2M motorized Separates large numbers of PCBs without fatigue of the operator. The lower circular blade is driven by a motor. The PCB is fed between the circular blades whe
Industry News | 2003-04-07 10:16:38.0
Portable Products and Optoelectronic Applications Still Hold Promise for Growth
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Parts & Supplies | SMT Equipment
03044362-01 Strain relief bracket 10pole 03044443-01 Cable harness analog 03044521-01 Ring spanner compl. 03044534-01 Kugelumlaufeinheit 12 C 03044704-01 DIN 625 - 609/9 - 2Z 03044753-01 Retrofit Kit Flap Tapecontainer X16 03044754-01 Retrofit
Parts & Supplies | Pick and Place/Feeders
1 High Speed Mater KE-2050 Since 1993, it has been selling "KE series" products and has received high praise from customers at home and abroad for many years. The series of products are combined with a chip machine and a general purpose ma
Technical Library | 2024-02-02 07:48:31.0
Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer In today's rapidly evolving electronics manufacturing landscape, optimizing efficiency, cost-effectiveness, and precision remains paramount. Businesses engaged in producing industrial control boards, computer motherboards, mobile phone motherboards, and mining machine boards face ongoing challenges in streamlining production processes. The integration of expensive equipment strains budgets, making the creation of an efficient, cost-effective high-speed SMT line a daunting task. However, a solution exists that seamlessly combines these elements into a singular, high-performance, and cost-effective SMT line. Let's delve into the specifics. A Comprehensive High-Speed SMT Line Our innovative solution amalgamates two pivotal components: a cutting-edge SMT (Surface Mount Technology) production line and a laser cutting line equipped with a depanelizer. The SMT Production Line The high-speed SMT line comprises several essential components, each fulfilling a unique role in the manufacturing process: 1. PCB Loader: This initial stage involves loading boards onto the production line with utmost care. Our Board Loader prioritizes safety, incorporating various safety light curtains and sensors to promptly halt operations and issue alerts in case of any anomalies. 2. Laser Marking Machine: Every PCB receives a unique two-dimensional code or barcode, facilitating comprehensive traceability. Despite the high-temperature laser process potentially leading to dust accumulation on PCB surfaces, our dedicated PCB Surface Cleaner swiftly addresses this issue. 3. SMT Solder Paste Printer: This stage involves applying solder paste to the boards, a fundamental step in the manufacturing process. 4. SPI (Solder Paste Inspection): Meticulous inspections are conducted at this stage. Boards passing inspection proceed through the NG (No Good) Buffer Conveyor to the module mounters. Conversely, "No Good" results prompt storage of PCBs in the NG Buffer Conveyor, capable of accommodating up to 25 PCBs. Operators can retrieve these NG boards for rework after utilizing our specialized PCB Mis Cleaner to remove solder paste. 5. Module Mounters: These machines excel in attaching small and delicate components, necessitating precision and expertise in the module mounting process. 6. Standard Pick And Place Machines: The selection of these machines is contingent upon your specific BOM (Bill of Materials) list. 7. Pre-Reflow AOI (Automated Optical Inspection): Boards undergo examination for component quality at this stage. Detected issues prompt the Sorting Conveyor to segregate boards for rework. 8. Reflow Oven: Boards undergo reflow soldering, with our Lyra series reflow ovens recommended for their outstanding features, including nitrogen capability, flux recycling, and water cooling function, ensuring impeccable soldering results. 9. Post-Reflow AOI: This stage focuses on examining soldering quality. Detected defects prompt the Sorting Conveyor to segregate boards for further inspection or rework. Any identified defects are efficiently addressed with the BGA rework station, maintaining the highest quality standards. 10. Laser Depanelizer: Boards advance to the laser depanelizer, where precision laser cutting, often employing green light for optimal results, ensures smoke-free, highly accurate separation of boards. 11. PCB Placement Machine: Cut boards are subsequently managed by the PCB Placement Machine, arranging them as required. With this, all high-speed SMT line processes are concluded. Efficiency And Output This production line demonstrates exceptional productivity when manufacturing motherboards with approximately 3000 electronic components, boasting the potential to assemble up to 180 boards within a single hour. Such efficiency not only enhances output but also ensures cost-effectiveness and precision in your manufacturing processes. At I.C.T, we specialize in crafting customized SMT production line solutions tailored to your product and specific requirements. Our equipment complies with European safety standards and holds CE certificates. For inquiries or to explore our exemplary post-sales support, do not hesitate to contact us. The I.C.T team is here to elevate your electronics manufacturing to new heights of efficiency and cost-effectiveness.
Technical Library | 2015-07-14 13:19:10.0
Bottom terminated components (BTC) are leadless components where terminations are protectively plated on the underside of the package. They are all slightly different and have different names, such as QFN (quad flat no lead), DFN (dual flat no lead), LGA (land grid array) and MLF (micro lead-frame. BTC assembly has increased rapidly in recent years. This type of package is attractive due to its low cost and good performance like improved signal speeds and enhanced thermal performance. However, bottom terminated components do not have any leads to absorb the stress and strain on the solder joints. It relies on the correct amount of solder deposited during the assembly process for having a good solder joint quality and reliable reliability. Voiding is typically seen on the BTC solder joint, especially on the thermal pad of the component. Voiding creates a major concern on BTC component’s solder joint reliability. There is no current industry standard on the voiding criteria for bottom terminated component. The impact of voiding on solder joint reliability and the impact of voiding on the heat transfer characteristics at BTC component are not well understood. This paper will present some data to address these concerns.
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
03044362-01 Strain relief bracket 10pole 03044443-01 Cable harness analog 03044521-01 Ring spanner compl. 03044534-01 Kugelumlaufeinheit 12 C 03044704-01 DIN 625 - 609/9 - 2Z 03044753-01 Retrofit Kit Flap Tapecontainer X16 03044754-01 Retrofit
Events Calendar | Mon Feb 19 00:00:00 EST 2024 - Mon Feb 19 00:00:00 EST 2024 | ,
SMTA Webinar: Development of Wireless Strain Measurement for Printed Circuit Board
Events Calendar | Thu Aug 23 00:00:00 EDT 2018 - Thu Aug 23 00:00:00 EDT 2018 | ,
Strain Gauge Data Can Be Misleading | Predicting Strain Levels Caused by Mounting PCBs in Housing Using the ICT Analysis Feature of Sherlock
Career Center | , | Engineering,Maintenance,Management,Production,Technical Support
Having 10+years of Experience in manufacturing (SMT),Field Engineer Globally For Universal SMT Equipment .
Career Center | Columbus, Ohio USA | Engineering,Management,Production,Quality Control,Research and Development,Technical Support
20 plus years of experience in a Electronics Manufacturing environment. Management experience on 1st and 2nd shift with groups up to 18 in a goverment contracted environment Experienced internal/lead auditor of ISO 9001 with years of audit experi
The Application of Spherical Bend Testing to Predict Safe Working Manufacturing Process Strains SMTnet Express January 9, 2013, Subscribers: 26086, Members: Companies: 9075, Users: 34138 The Application of Spherical Bend Testing to Predict Safe
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/ksp-2-120-e4-strain-gages-188522?page=22&category=1129&order=name+desc
PANASONIC STRAIN GAGES KSP-2-120-E4 | QYSMT × Home About US ABOUT US FAQ SMT spare parts SMT Surplus equipments SMT peripheral equipments News Contact US 0 0 Sign in Contact Us Products Panasonic AI STRAIN GAGES Public Pricelist Public Pricelist
| https://www.eptac.com/faqs/ask-helena-leo/ask/soldering-wires-to-pads-with-a-lap-joint
: I was wondering if you might be able to help me. We have some strain gauges on an assembly and need to solder wires to the strain gauge pads