New Equipment | Education/Training
The Electronics Industry’s Source of Data and Insights for Smart Business Decisions. The IPC Technology Market Research Council offers members unique and customized research for the electronics assembly industry. Network with industry leaders at ex
JUKI RS-1XL Pick and Place Machine Speed:42000CPHPCB Size : 650×560㎜Feeder input:112pcsWeight: 1850KGProduct description: JUKI RS-1XL Pick and Place Machine, Speed:42000CPH, PCB Size : 650×560㎜, Feeder input:112pcs, Weight: 1850KG JUKI RS-1XL P
Electronics Forum | Wed Nov 21 07:52:15 EST 2007 | avalancher
Hello! You may want to be more specific whereas each of those companies produce different machines. You have basic introductory machines, and high-end machines. Some provide faster speeds, some provide a wider range of component handling.
Electronics Forum | Thu Feb 11 15:50:33 EST 2010 | glennster
Sergey, For a component OEM lab I agree that X-ray is probably the first priority, especially for process development and monitoring. Be sure to get a system with sample tilt and high resolution capability. When SAM is needed, a service provide
.jpg)
Used SMT Equipment | Adhesive Dispensers
NM-DC15 HDF big table HIGH-SPEED ADHESIVE DISPENSER A high-speed adhesive application machine with a screw-type application head ensures stable application at 0.07 sec/shot regardless of temperature, viscosity or the amount or remaining
Used SMT Equipment | General Purpose Equipment
Year 2008 - Like New Condition Tyco SEP 3T Shuttle Electric Press Standalone electric press for the application of PCBs onto compliant pin housings or connectors • Servo electric press with shuttle system for product location under press ram • Ho
Industry News | 2003-06-25 12:28:40.0
The chart includes a variety of diagrams, tables, and ratio charts for RF Emissions; Direct RF Power Injection; Bulk Current Injection (BCI); ESD and Transients; as well as TEM Cell and Stripline testing.
Industry News | 2014-10-28 19:14:24.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference scheduled to take place November 18-20, 2014 at the Chicago Marriott in Schaumburg, Illinois.
Parts & Supplies | Pick and Place/Feeders
YG200 UP DOWN component KGT-M7162-00X No. Part No. Part Name Q'ty Remarks Date Revised No. 1 KV8-M7101-00X HOUSING HEAD 1 2 KV8-M7103-50X PLUG 2 3 K65-M257M-00X O-RING 3 4 S12.5 3-1 90200-01J125 O-RING 3 4 S12.5 4 KM1-M7140-00X PACKING 4 MYR-6
Parts & Supplies | Pick and Place/Feeders
Component-Magazine long VS0-56
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Technical Library | 2015-08-27 15:32:16.0
Ever since there has been a widespread usage of surface mount parts, the trend of continued shrinkage of devices with ever finer pitches has continued to challenge PCB assemblers for the rework of same. Todays' pitches are commonly 0.5 to 0.4mm with packages of tiny outline sizes, 5 -10mm square, making the rework of such devices a challenge. In addition to the handling and inspection challenges comes the board density. Spacing to neighboring components continues to be compressed so the rework techniques should not damage neighboring components.
Speed and Flexibility for High Quality Production of any PCB With maximum speed up to 42,000CPH (Optimum) and 29,000CPH (IPC9850), the RS-1XL is designed for maximum throughput. The RS-1XL supports components from 0201 metric (008004") up to 74
Brand new modular mounter RX-6 combines high productivity, high flexibility and high quality using non-stop vision recognition and meets the demands of a wide range of components and boards.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Thu Mar 18 00:00:00 EDT 2021 - Thu Mar 18 00:00:00 EDT 2021 | ,
India Chapter Webinar: PCBA Process Qualifications
Events Calendar | Tue Jul 17 00:00:00 EDT 2018 - Wed Jul 18 00:00:00 EDT 2018 | ,
Fan Out Packaging- Technology Overview and Evolution - SMTA Webtorial
Career Center | San DIego (Mira Mesa), California USA | Engineering,Maintenance,Production
Duties: Supports, develops and optimizes manufacturing processes. Reviews quality metrics to help produce high quality, repeatable processes. Assists with supporting and improving the SMT process (print process, placement, reflow, package-o
Career Center | Orange County, California USA | Quality Control
Job Description: Summary: Reporting to the COO/CTO the VP of Quality role will involve creating and/or augmenting the Quality system and programs to be a pro-active vs. a reactive structure. This will involve creating an overall quality vision, se
it was clear. An SMD component was placed on the surface o
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/about-us/nordson-blog/electronics-solutions-blogs/selective-vs-wave-soldering
Selective vs Wave Soldering Search Arrow Black Arrow Right Arrow Youtube Twitter Facebook Paper Plane LinkedIn Zoom In Grid Envelope Earth Download File - Document 9 Boxes Browser Calendar Chart Click
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic2884&OB=DESC.html
JEDEC VS IPC - PCB Libraries Forum Forum Home > General > General Discussion New Posts FAQ Search Events Register Login JEDEC VS IPC
