Industry Directory | Equipment Dealer / Broker / Auctions
At ZJ-SMT, we provide premium SMT and PCB assembly equipment and components from leading brands such as Panasonic, Yamaha, Fuji, etc.
Industry Directory | Manufacturer
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Volumetric Dispense Pump - PCD Technology revolutionizes how you dispense and how you perceive dispensing. PCD - Progressive Cavity Displacement PCD is a continuously volumetric dispense pump based on the Progressive Cavity principle. PCD technolog
Electronics Forum | Wed Mar 28 10:56:56 EST 2001 | jseagle
Does anyone know the formula for calculating the grams per sq cm of lead for mounting bottomside unglued components? Thanks James
Electronics Forum | Wed Mar 28 11:29:49 EST 2001 | gcs
I've used below: WEIGTH OF COMPONENT IN GRAMS ---------------------------- TOTAL PAD MATING AREA IN SQUARE INCHES GRAMS PER SQUARE INCH MUST BE EQUAL/GREATER THAN 30 FOR SECONDARY MOUNTING.
Used SMT Equipment | Soldering - Wave
2005 Speedline Technologies Vectra 450F Wave Solder Note: The solder pot is full of lead-free solder. The weight of this solder is estimated at 1600 lbs. Item Location: Westerville, OH USA Serial: 498509 Features: Ultra Fill Lead-Free OptiFlux II Int
Used SMT Equipment | Chipshooters / Chip Mounters
JUKI FX-3 Pick and Place machine Specification Substrate dimension: L- substrate-(410×360mm) L-wide substrate-(510×360mm)*1 XL substrate-(610×560mm) Component Height:6mm size Component range : laser discrimination radar system,0402(British 01005) ~
Industry News | 2003-06-18 07:56:46.0
The IPC-9850 test materials kit includes all the materials needed for manufacturers to test flexible placement machines and chip shooters to the specifications of the IPC-9850 standard.
Industry News | 2003-03-13 08:19:18.0
The Flakafix 2.54mm grid IDC board-to-cable connector can now be supplied with a variety of terminations including surface mount, solder-in, press-fit and pin-in-paste.
Parts & Supplies | Chipshooters / Chip Mounters
Model :KE-750 Placement speed：14, 400CPH(0.25sec/chip) Component mount range:1.0x0.5mm~□20mm or 23.5x11mm Station:80 Power supply:1P/200V/2.5KVA Size:1,400x1, 410x1, 551mm Weight:1,150kg Currently, all the machines with very good competitive
Parts & Supplies | Assembly Accessories
Product name: YV100XG YAMAHAmulti-functional chip mounter Product number: YV100XG Products in detail YAMAHA multi-function chip mounter YAMAHAYV100XG High speed and high precisionmulti-function modular placement machine 0.18 seconds/CHIP ul
Technical Library | 2014-08-14 17:58:41.0
High reliability applications for high performance computing, military, medical and industrial applications are driving electronics packaging advancements toward increased functionality with decreasing degrees of size, weight and power (SWaP) The substrate technology selected for the electronics package is a key enabling technology towards achieving SWaP. Standard printed circuit boards (PWBs) utilize dielectric materials containing glass cloth, which can limit circuit density and performance, as well as inhibit the ability to achieve reliable assemblies with bare semiconductor die components. Ceramic substrates often used in lieu of PWBs for chip packaging have disadvantages of weight, marginal electrical performance and reliability as compared to organic technologies. Alternative materials including thin, particle-containing organic substrates, liquid crystal polymer (LCP) and microflex enable SWaP, while overcoming the limitations of PWBs and ceramic. This paper will discuss the use of these alternative organic substrate materials to achieve extreme electronics miniaturization with outstanding electrical performance and high reliability. The effect of substrate type on chip-package interaction and resulting reliability will be discussed. Microflex assemblies to achieve extreme miniaturization and atypical form factors driven by implantable and in vivo medical applications are also shown.
Technical Library | 2018-07-18 16:28:26.0
Reduction of first pass defects in the SMT assembly process minimizes cost, assembly time and improves reliability. These three areas, cost, delivery and reliability determine manufacturing yields and are key in maintaining a successful and profitable assembly process. It is commonly accepted that the solder paste printing process causes the highest percentage of yield challenges in the SMT assembly process. As form factor continues to get smaller, the challenge to obtain 100% yield becomes more difficult.This paper will identify defects affecting SMT yields in the printing process and discuss their Root Cause. Outer layer copper weight and surface treatment will also be addressed as to their effect on printability. Experiments using leadless and emerging components will be studied and root cause analysis will be presented
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Name:Semi-automatic capacitor cutting machine Model:SC-104A Voltage :220V AC 60Hz/50Hz 40W Size:L360*W300*H350MM Weight:35kg Efficiency:2500-3000PCS/H (It depends on the worker) Features: 1. suitable for bulk, tube radial parts cutting foot ope
Events Calendar | Mon Aug 24 00:00:00 EDT 2020 - Fri Aug 28 00:00:00 EDT 2020 | Virtual Event, USA
Adhesives & Bonding Expo Connect
Events Calendar | Tue Mar 23 00:00:00 EDT 2021 - Thu Mar 25 00:00:00 EDT 2021 | Novi, Michigan USA
Adhesives & Bonding Expo
Career Center | Seven Hills, Ohio USA | Engineering,Production
The qualified candidate will be responsible for the operation and progamming of pick and place machines. This will include operating screen printing equipment set-up of reflow and cleaning systems and tear down of said systems. Hand soldering of in
Career Center | Seven Hills, Ohio USA | Engineering,Production
The qualified candidate will be responsible for the operation and progamming of pick and place machines. This will include operating screen printing equipment set-up of reflow and cleaning systems and tear down of said systems. Hand soldering of in
Career Center | Lapu-lapu, Cebu Philippines | Engineering,Maintenance,Production
Sept. 2, 2009 to Present, TPM2, LEAR Corporation, MEPZ-1, Lapu-Lapu City • Provides SMT engineering support to day-to-day manufacturing operations. • Handles SMT pick-and-place machine (Fuji, CP7, CP6 and QP242 Series, Universal Genesis GI-14D). •
Career Center | Reno, Nevada USA | Engineering,Maintenance,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
Extensive technical background including tenures providing robotics technology expertise to diverse national and international clients and supporting surface mount technologies for printed circuit board (PCB) manufacturing processes. Results-oriente
Mass Analysis Of The Components Separated From Printed Circuit Boards. Mass Analysis Of The Components Separated From Printed Circuit Boards. Methods of effective and ecological recycling of printed circuit boards (PCBs) are searched all over
1st Place Machinery Inc. | http://www.firstplacemachinery.com/firstplace_europlacer_pick_and_place.html
Europlace Pick and Place Europlacer Placement Machine Serial Number: 505 Model Number: Progress 6 Min/Max Board Size: 50 x 50 x 0.5 mm - 500 x 460 x
GPD Global | https://www.gpd-global.com/dispense-and-pick-and-place.php
Dispense System, Pick and Place Home Products Fluid Dispensing Equipment High Precision Dispenser - MAX Series Large Format Board Dispensing - DS Series Table Top Dispensing Equipment Loader
