Yamaha YSM10 Pick and Place High-speed Modular SMT Placement ❙ Features of Yamaha SMT Placement Yamaha fastest SMT placement machines , Yamaha SMT pick and place machine, Yamaha chip mounter, for SMT assembly system. pleas
Yamaha YSM40R High-Speed Modular SMT Chip Mounter ❙ Features of Yamaha YSM40R Yamaha Ultra-High speed modular pick and place machine YSM40R, Yamaha modular chip mounter, Achieves revolutionary productivity of 200,00
Used SMT Equipment | Pick and Place/Feeders
JUKI SMT machine RX-7R element mount speed (best condition) : chip element 75,000CPH ELEMENT SIZE: 03015 chip □25mm square element P16 suction nozzle mount head, realized high-speed, high-density Mount p 8 suction nozzle mount head to the small
New Equipment | Education/Training
The J-STD-001 Space Electronics Hardware Addendum provides additional requirements over those published in IPC J-STD-001 to ensure the reliability of soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic env
Used SMT Equipment | AOI / Automated Optical Inspection
Model YSi-V Camera Pixel Nos. 12 Million Pixels 5 Million Pixels Type 12M TypeHS 12M TypeS 12M TypeDF 5M Resolution 12μm 7μm 12μm 7μm 12μm 18μm Applicable PCB Dimensions (mm) L 610 x W 560 (Max) - L 50 x W 50 mm (Mi
Used SMT Equipment | Pick and Place/Feeders
Yamaha YV100X parameters Substrate size ATS20 (end orientation) W-AT assembly: L460*W250(Max)/L50*W50(Min) Substrate thickness 0.4-3.0 SMD components can be placed 100 kinds (8MM) Board transfer direction right-left Mounting accuracy ±0.1m
Parts & Supplies | Pick and Place/Feeders
YAMAHA CL8mm feeder reel KW1-M1191-00X DRIVE ROLLER UNIT YAMAHA CL8mm feeder reel KW1-M1191-00X DRIVE ROLLER UNIT 1.copy and original new; 2.competitive price. YAMAHA CL8mm feeder reel KW1-M1191-00X DRIVE ROLLER UNIT Product Code: 8mm feeder
Used SMT Equipment | Pick and Place/Feeders
RS-1 Board Size max. 650 mm × 370 mm (single clamping) max. 950 mm × 370 mm (double clamping) max. 1,200 mm × 370 mm (double clamping)*1 Component Height 25 mm Component Size 0201*2 (metrisch) ~ 74 mm / 50 × 150
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Introducing the ezCLIP universal stop clip for PCB magazine racks. The ezCLIP system was created to allow electronics manufacturers who manually load/unload PCB magazine racks a simple way to distinguish required spacing between boards and to prevent
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