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Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
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Features ●Suitable for high hardness aluminum, copper LED strip PCB. Two PCBAS can be separated at a time (ML-360B). ●Applicable PCB material:Aluminum,Copper,etc. ●Manually feding and precise positioning to separate PCBA. ●Progressive separation of f
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