Full Site - : components stress (Page 15 of 77)

Avoidance of Ceramic-Substrate-Based LED Chip Cracking Induced by PCB Bending or Flexing

Technical Library | 2022-09-25 20:18:33.0

Printed circuit board (PCB) bending and/or flexing is an unavoidable phenomenon that is known to exist and is easily encountered during electronic board assembly processes. PCB bending and/or flexing is the fundamental source of tensile stress induced on the electronic components on the board assembly. For more brittle components, like ceramic-based electronic components, micro-cracks can be induced, which can eventually lead to a fatal failure of the components. For this reason, many standards organizations throughout the world specify the methods under which electronic board assemblies must be tested to ensure their robustness, sometimes as a pre-condition to more rigorous environmental tests such as thermal cycling or thermal shock.

Cree Lighting

Going Lead Free With Vapor Phase Soldering - Lead Free Is Still a Challenge For Major Industries.

Technical Library | 2014-01-30 18:08:04.0

As of today, the electronic industry is aware of the requirements for their products to be lead free. All components are typically available in lead free quality. This comprises packages like BGAs with BGA solder balls to PCB board finishes like HASL. The suppliers are providing everything that is needed. It is harder to get the old tin leaded (SnPb) components for new applications today, than lead free ones. So why has not everybody changed over fully yet and how can the challenges be overcome? A big concern in this transition process is reflow soldering. The process temperatures for lead free applications became much higher. Related with this is more stress for all the components. It affects the quality and reliability of the electronic units and products...

IBL - Löttechnik GmbH

YSV 4A Automatic PCB DEPANELING MACHINE

YSV 4A Automatic PCB DEPANELING MACHINE

Videos

YUSH Electronic Technology Co.,Ltd Features: For the automatic pcb cutting equipment developed for the COB light source board, the microcomputer is used to control the automatic feeding board. Suitable for PCB board, aluminum substrate, copper boa

YUSH Electronic Technology Co.,Ltd

AI Technology (AIT) Introduces Novel High Temperature Large Area Underfill with Proven Stress Absorption

Industry News | 2014-07-28 13:56:52.0

240°C and novel stress absorbing capabilities to allow long-term reliability of large area flip-chip devices.

AI Technology, Inc. (AIT)

EL thermal imaging system camera upgrade

Industry News | 2008-03-18 14:12:26.0

OptoTherm EL system

OptoTherm, Inc.

London Electronics Ltd.

London Electronics Ltd.

New Equipment |  

Designers and manufacturers of digital panel meters and large digital displays for process monitoring and control. The unique INTUITIVE range offers simple, menu-free setup to help users get up and running with minimum stress and time.

London Electronics Ltd.

London Electronics Ltd.

New Equipment |  

Designers and manufacturers of digital panel meters and large digital displays for process monitoring and control. The unique INTUITIVE range offers simple, menu-free setup to help users get up and running with minimum stress and time.

London Electronics Ltd.

Motorized PCB Separator MDS 508

Motorized PCB Separator MDS 508

Videos

Quick Overview: Motor-driven MDS-508-500/509-500 separates v-scored PCBs without stress to boards, components or solder joints. it is suited for medium to high-volume production,available with 460 mm or 600 mm (option) maximum cutting length. Cut le

1ClickSMT Technology Co., Ltd.

Automatic PCB depaneling Lowest cutting stress pcb depaneling V-SCORING PCB separator

Automatic PCB depaneling Lowest cutting stress pcb depaneling V-SCORING PCB separator

Videos

Features:  For the automatic pcb cutting equipment developed for the COB light source board, the microcomputer is used to control the automatic feeding board. Suitable for PCB board, aluminum substrate, copper board slitting. Widely used in auto

YUSH Electronic Technology Co.,Ltd

Automatic PCB Depanelizer 2a

Automatic PCB Depanelizer 2a

New Equipment | Depaneling

V groove pcb separator machine specification: Size:780 X 460X 560mm Machine Weight: 55Kg Minimize thickness: 0.6-3.5mm Minimize Speed: 100/200/300/500mm/s Features: 1. Separate pre-scored PCB assembly without stress on either PCB or componen

HuiKe Tech


components stress searches for Companies, Equipment, Machines, Suppliers & Information

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