Dinghua Technology-- the leading manufacturer of BGA rework station, Automatic screw locking machine, Automatic soldering station and non-standard equipment. For more details, please just contact John, WhatsApp/Wechat:+86 1576811 4827 , Skype: si
Industry News | 2008-05-30 10:22:55.0
OptoTherm offers environmental enclosure for EL system
Used SMT Equipment | In-Circuit Testers
Agilent 71612B-UHF Digital Transmission Tester 12Gb/s The 71612B error performance analyzer addresses applications for high speed digital testing up to 12 Gb/s, including R&D and manufacturing test of lightwave components and sub-assemblies, ad
Used SMT Equipment | In-Circuit Testers
Agilent-Keysight 71612B-UHF Digital Transmission Tester 12Gb/s The 71612B error performance analyzer addresses applications for high speed digital testing up to 12 Gb/s, including R&D and manufacturing test of lightwave components and sub-assem
Used SMT Equipment | In-Circuit Testers
Agilent-Keysight 71612B-UHF Digital Transmission Tester 12Gb/s The 71612B error performance analyzer addresses applications for high speed digital testing up to 12 Gb/s, including R&D and manufacturing test of lightwave components and sub-assem
Technical Library | 2014-04-03 18:01:13.0
A system level modeling methodology is presented and validated on a simple case. It allows precise simulations of electrostatic discharge (ESD) stress propagation on a printed circuit board (PCB). The proposed model includes the integrated circuit (IC) ESD protection network, IC package, PCB lines, passives components, and externals elements. The impact of an external component on the ESD propagation paths into an IC is demonstrated. Resulting current and voltage waveforms are analyzed to highlight the interactions between all the elements of an operating PCB. A precise measurement technique was designed and used to compare with the simulation results. The model proposed in this paper is able to predict, with good accuracy, the propagation of currents and voltages into the whole system during ESD stress. It might be used to understand why failures occur and how to fix them with the most suitable solution.
Extensive Cutting and Forming Equipment For Any Job. We also offer a comprehensive package of value added and lead preparation available. We have the capability to handle every request from straight cuts to the most exotic forms that you may require
Illinois Components, Inc. Tape & Reel and I.C. Programming Services
For heat dissipation Conventional methods measure an adhesive's bulk conductivity, in watts/m-°K. However, across a thin bondline, the resistance of the adhesive itself is only a fraction of the total resistance. Interfacial resistance is a signifi
Technical Library | 2022-09-25 20:03:37.0
Cracking remains the major reason of failures in multilayer ceramic capacitors (MLCCs) used in space electronics. Due to a tight quality control of space-grade components, the probability that as manufactured capacitors have cracks is relatively low, and cracking is often occurs during assembly, handling and the following testing of the systems. Majority of capacitors with cracks are revealed during the integration and testing period, but although extremely rarely, defective parts remain undetected and result in failures during the mission. Manual soldering and rework that are often used during low volume production of circuit boards for space aggravate this situation. Although failures of MLCCs are often attributed to the post-manufacturing stresses, in many cases they are due to a combination of certain deviations in the manufacturing processes that result in hidden defects in the parts and excessive stresses during assembly and use. This report gives an overview of design, manufacturing and testing processes of MLCCs focusing on elements related to cracking problems. The existing and new screening and qualification procedures and techniques are briefly described and assessed by their effectiveness in revealing cracks. The capability of different test methods to simulate stresses resulting in cracking, mechanisms of failures in capacitors with cracks, and possible methods of selecting capacitors the most robust to manual soldering stresses are discussed.
Industry Directory | Manufacturer
Thermally Managed ( up to 1000 W /m K thermal transfer rate ), CTE controlled, Very Rigid, Light Weight STABLCOR PCB / Substrate Technology
