Industry News | 2012-02-15 19:03:23.0
Nihon Superior announces that its Senior Technical Advisor Keith Sweatman will present “The Effect of Composition on the Thickness Morphology and Growth of Interfacial Intermetallic in Pb-Free Solders” at the upcoming TMS Annual Conference. The presentation will take place during the session, titled “Pb-Free Solders and Other Materials for Emerging Interconnect and Packaging Technologies: Solder Alloy Design for Challenging Applications”.
Industry News | 2016-02-12 10:54:50.0
KYZEN announces plans to exhibit in Booth #E1.1216 at productronica China, scheduled to take place March 15-17, 2016, at the Shanghai New International Expo Centre. KYZEN will discuss recent research that points to ways to improve stencil printing reliability. The research strongly supports the need for a wet wipe with an engineered solvent that matches to the flux composition.
Industry News | 2011-06-16 13:42:41.0
Shocking Technologies announced that Multek, a wholly owned subsidiary of Flextronics, has been certified to manufacture printed circuit boards (PCBs) with Shocking Tech’s innovative Voltage Switchable Dielectric™ (VSD) material. The certification is the result of extensive collaboration between the two companies and successful testing of Shocking Tech’s XStatic™ VSD material into PCBs manufactured by Multek.
Industry News | 2009-12-10 01:02:42.0
EAST WINDSOR, CT — December 2009 — High-Tech Conversions Inc., a manufacturer of high-quality wiping products and a supplier of consumable items used in cleanrooms, assembly lines, laboratories and manufacturing, introduces THE AQUAVATOR™ stencil wiping fabric, a revolutionary new development within the science of automatic stencil cleaning.
Industry News | 2016-04-21 00:17:09.0
SHENMAO Technology will present the technical paper "A New Dispensing Solder Paste for Laser Soldering Technology" at the 10th. Anniversary of the SMTA International Conference of Soldering and Reliability 2016 in Toronto, Canada, featuring advancements in newly developed composition of Powder, Fluxes and produces best dispensability, minimal flux residue, no-splash or solder balling issues and minimal and smaller voids.
ProActiv is a breakthrough process technology that dramatically improves solder paste transfer efficiency with stencil printing. It redefines the boundaries of Area Ratio rules for stencil apertures, which dictate the smallest apertures that can be p
Industry News | 2008-12-23 10:23:13.0
LOGAN, UTAH � Inovar, an inthinc company and a leading contract electronics manufacturer (CEM) dedicated to providing flexible solutions to OEMs in the fastest growing segments of the electronic industry, announces that it has expanded its capabilities with the acquisition of a new Fischer Technologies FISCHERSCOPE X-RAY XDAL.
Technical Library | 2018-04-18 23:55:01.0
Higher functionality, higher performance and higher reliability with smaller real estate are the mantras of any electronic device and the future guarantees more of the same. In order to achieve the requirements of these devices, designs must incorporate fine line and via pitch while maintain good circuitry adhesion at a smooth plating-resin interface to improve signal integrity. The Semi-Additive Process (SAP) is a production-proven method used on low dielectric loss tangent (Df) build-up materials that enables the manufacture of ultra-fine circuitry. (...) This paper will discuss a new SAP process for low loss build-up materials with low desmear roughness (Ra= 40-100 nm) and excellent adhesion (610-680 gf/cm) at various processing conditions. Along with the process flow, the current work will also present results and a discussion regarding characterization on the morphology and composition of resin and/or metal plating surfaces using scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDX), surface roughness analysis, plating-resin adhesion evaluation from 90o peel tests
Technical Library | 2023-09-26 19:14:44.0
The transition from tin-lead to lead free soldering in the electronics manufacturing industry has been in progress for the past 10 years. In the interim period before lead free assemblies are uniformly accepted, mixed formulation solder joints are becoming commonplace in electronic assemblies. For example, area array components (BGA/CSP) are frequently available only with lead free Sn-Ag-Cu (SAC) solder balls. Such parts are often assembled to printed circuit boards using traditional 63Sn-37Pb solder paste. The resulting solder joints contain unusual quaternary alloys of Sn, Ag, Cu, and Pb. In addition, the alloy composition can vary across the solder joint based on the paste to ball solder volumes and the reflow profile utilized. The mechanical and physical properties of such Sn-Ag-Cu-Pb alloys have not been explored extensively in the literature. In addition, the reliability of mixed formulation solder joints is poorly understood.
Industry News | 2004-02-11 15:41:53.0
MPEG104� PC/104-Plus MPEG-1 Encoder Especially Designed for Live Video Encoding Applications Where Rugged Environmental Conditions and Space Constraints Exist
