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Merix Corporation Updates Guidance for the Third Quarter of Fiscal 2003

Industry News | 2003-01-31 09:39:08.0

Expected to be Below the Guidance Provided During the Company's Earnings Conference Call on December 18, 2002

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California Micro Devices Announces Enhanced EMI Filtering with ESD Protection for GSM Handsets

Industry News | 2003-02-25 09:10:01.0

The CSPEMI400 complements California Micro Devices' broad portfolio of CSP (chip scale package) devices for stand-alone ESD protection and EMI filter arrays with ESD protection, making it the most extensive in the industry.

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Nam Tai Electronics, Inc. Appoints Mr. Guy Bindels As Research and Development Director

Industry News | 2003-03-05 08:35:10.0

he will be responsible for formulating R&D strategies and spearheading the Company to keep abreast of the latest development in global manufacturing technology as well as strengthen its R&D division.

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Proposed Merger of Beyonics and Flairis Announced

Industry News | 2003-03-25 08:31:07.0

On completion of the transaction, Flairis will become a wholly-owned subsidiary of Beyonics and its shares will be delisted from Sesdaq.

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Low-Cost UNIX- and PC-Based Boundary-Scan Upgrade for Agilent 3070 In-Circuit Testers

Industry News | 2003-04-03 08:51:07.0

Symphony 3070TM Package from JTAG Technologies for Testing and In-System Flash / PLD Programming

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Fairchild Announces Industry's First SSOT-6 FLMP N-Channel MOSFETs

Industry News | 2003-05-22 08:36:27.0

Packaging Saves PCB Board Space Without Sacrificing Power Dissipation Capability

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Cadence Announces Aptivia Parallel Characterization Option

Industry News | 2003-06-02 09:14:01.0

Specification-Driven Circuit Design Environment Now Slashes Validation Time Up to 10x

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REMEC Deploys AWR Design Flow Worldwide

Industry News | 2003-06-09 09:16:38.0

The adoption of AWR EDA software supports REMEC�s continuous efforts to manage the substantial challenges of today�s wireless design technology.

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Merix Corporation Establishes Representative Office and Inventory Hub in China

Industry News | 2003-06-30 08:19:29.0

Merix has also entered into an agreement with YCH GROUP PTE. LTD to support its inventory hub, which is also in Suzhou.

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Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

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