Industry Directory | Consultant / Service Provider
Computer - Sales,Computer - Exchanges,Used Computers,Computer Accessories,Computer services,Computer AMC's.
S M Computer Services: computer sales and services. We deal in computer system, networking, Linux, server, laptop printer. All kind of Computer peripherals repairing and selling. For more informatio
Dual Chamber Module - Dual Chambers + Dual Blowers + Dual Heaters + Dual T/Cs. Bifurcated (Dual) chamber reflow oven allows 2 different thermal profiles to run simultaneously in the same reflow oven foot print Improved temperature uniformity acro
Simplify Dispensing with GPD Global’s Island Series Dispense Platforms Island Series robots give you versatility to do simple, repetitive automation jobs. Work areas range from 300 mm x 400 mm to 400 mm x 400 mm. All Island Series robots are compati
Used SMT Equipment | Other Equipment
Nordson SelectCoat SC100HS Series Conformal Coating Machine Serial: BK89F05751 Features: Includes manuals, pots and computer Item Location: Hudson, OH USA
Used SMT Equipment | Screen Printers
2003 DEK Horizon 01 Screen Printer *** Note: This lot contains two items. (1) DEK Horizon 01 Screen Printer (1) DEK VF35 Vacuum System Approx Dimensions: 70" x 70" x 68" Location: Jasper, IN USA Serial: 281505 Features: o Advantec 2.05 Computer syste
Industry News | 2018-02-12 12:28:00.0
GPD Global introduces its NEW full-featured benchtop dispensing robot system: Catalina. A benchtop system does not mean "no features". This compact and efficient semi-auto dispense robot provides you with numerous standard features: automatic vision, laser surface sensing, and automatic nozzle alignment and calibration.
Industry News | 2018-09-06 12:12:07.0
GPD Global offers the ideal tabletop robots (Catalina Series) for precision dispensing.
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Simplify Dispensing with GPD Global’s Island Series Dispense Platforms Island Series robots give you versatility to do simple, repetitive automation jobs. Work areas range from 300 mm x 400 mm to 400 mm x 400 mm. All Island Series robots are compati
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Training Courses | | | IPC-A-610 Trainer (CIT)
The Certified IPC-A-610 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of electrical and electronic assemblies and prepares them to deliver Certified IPC-A-610 (CIS) training.
Training Courses | ON DEMAND | | IPC/WHMA-A-620 Trainer (CIT)
The Certified IPC/WHMA-A-620 Trainer (CIT) courses recognize individuals as qualified trainers in the area of cable and wire harness fabrication and installation, and prepares them to deliver Certified IPC/WHMA-A-620 Specialist (CIS) training.
Events Calendar | Mon Sep 07 18:30:00 UTC 2020 - Mon Sep 07 18:30:00 UTC 2020 | ,
Post – Moore's Law Electronics: From Now until Quantum Computing
Events Calendar | Wed Apr 14 18:30:00 UTC 2021 - Wed Apr 14 18:30:00 UTC 2021 | ,
LA/OC Chapter Meeting and Technical Presentation: Manufacturing Simulation
Career Center | Florham Park, New Jersey USA | Engineering
Field Service Engineer Job Description The basic function of this position: Installation, training, repair, and implementation of retrofits on the complete line of Heller reflow ovens. Candidate must be a US citizen. DUTIES AND RESPONSIBILITIES: S
Career Center | Rolling Meadows, Illinois USA | Quality Control
Job: PCB Assembly/Soldering Instructor Responsibilities: Provide instruction to students in IPC classes IPC-A-610, IPC JSTD-001, IPC 7711/21, IPC-A-620 Provide instruction to students in BEST classes Provide course content for and instruction to stu
Career Center | toronto, toronto Canada | Engineering
Technical Skills • Plan, Design, Implement , Build Electronic Devices according to specifications • Inspect, Diagnose, Repair, Replace, Calibrate, Modified Electronic Devices • Use Blue Prints, Drawings, Diagrams, Measuring instruments Computer Ski
Career Center | , Philippines | Engineering,Technical Support
Electronic manufacturing and Semiconductor equipment programming, sustenance and preventive maintenance. Knowledge in PLC, pneumatics and automated equipment. Desktop, Laptop computer servicing trouble-shooting, repair, hardware and software instal
GPD Global | https://www.gpd-global.com/co_website/pdf/doc/FLOware-Software-Guide-Addendum-Computer-Controls.pdf
2.9.3S This addendum includes content destined for the FLOware Software User Guide, PN 22100080D in the following sections: • Getting Started - User Interface - Computer Control with KVM Computer Control with KVM The dispense system KVM switch lets you easily change between multiple computers using a single set of KVM
| https://pcbasupplies.com/anti-static-1/
: S-E-5AS DESOLDERING BRAID, SEA BRAID, .125" X 5', ANTISTATIC, 25/PACK Used in the rework and repair of printed circuit boards, computers, cell phones, or other electronics Easily removes solder from components or pads on a circuit board
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