Henkel's diverse portfolio of adhesive and sealant solutions includes advanced materials technologies to address today’s most demanding applications. From electrically conductive and non-conductive paste adhesives through to thermally conductive diel
Industry Directory | Manufacturer
Electronic shielding manufacturer, specializing fabric-over-foam profile gaskets, shielding tapes, fabric-over-foam I/O gaskets, cable shielding, shielding laminates, board-level shielding and selectively coated, thermoformed shields.
Industry Directory | Distributor / Equipment Dealer / Broker / Auctions
When you are in the market for NSN, aviation, and electronic parts, utilize a premier purchasing platform such as Stacked NSN to secure all your requirements with unmatched pricing and rapid lead-times.
Industry Directory | Distributor
Boost Purchasing is reputable supplier of parts that can be used for business jets, regional jets, or other commercial jet models.
Industry Directory | Distributor
If you are in the market for civil and defense aviation parts, marine equipment, industrial components, IT hardware, or other such products, there is no better distributor than Integrated Plane Parts.
How to select and install a vacuum tip and pick and place a part using the pen-vac
Silver Filled, Electrically Conductive Ink for Screen Printing AG-800 is a unique, electrically conductive silver filled ink designed for high-speed screen printing in flex circuit, membrane switch, and other additive circuit applications. AG-800 i
Industry News | 2018-09-13 17:58:56.0
Engineered Material Systems announces plans to exhibit at EU PVSEC, scheduled to take place Sept. 25-28, 2018 in Brussels, Belgium. The company will showcase next-generation low cost conductive adhesives for stringing, shingling and back contact applications in crystalline silicon and heterojunction solar modules in Booth D2.
Technical Library | 2014-12-04 18:27:40.0
A review on applications of metal-based inkjet inks for printed electronics with a particular focus on inks containing metal nanoparticles, complexes and metallo-organic compounds. The review describes the preparation of such inks and obtaining conductive patterns by using various sintering methods: thermal, photonic, microwave, plasma, electrical, and chemically triggered. Various applications of metal-based inkjet inks (metallization of solar cell, RFID antennas, OLEDs, thin film transistors, electroluminescence devices) are reviewed.
Technical Library | 2013-03-07 18:25:36.0
The market for high-layer-count printed circuit boards (PCB) containing blind and buried vias was once relatively small, and focused on specialized applications in the military and high end computing. The demand for these types of PCBs today is being driven by an increasing number of commercial applications in the telecommunications and semiconductor test market segments. These applications typically require high-aspect-ratio plated-through-holes (PTHs) and blind and buried vias in order to meet the applications interconnect density requirements. Blind and buried vias and high aspect ratio PTHs continue to present manufacturing challenges and frequently are the limiting features to achieving high fabrication yield... First published in the 2012 IPC APEX EXPO technical conference proceedings
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