6 hours Thin Film Set Time (.001" @ 25°C) >12 hours Total % NV Solids 100% Hegman Gauge Volume Resi
New Equipment | Cleaning Agents
220°F~104°C Boiling Point 280°F~138°C Water Soluble Complete VOC, @10% 90.0 g/L Typical Processes: Application Spray
New Equipment | Cleaning Agents
220°F/104°C Boiling Point 240°F/115°C Water Soluble Complete VOC, @10% 88.9 g/L Typical Processes: Application In-Line
New Equipment | Cleaning Agents
200°F~93°C Boiling Point: 292°F~144°C Water Soluble: Partially miscible VOC, @ 10%: 88.45 g/L Typical Processes Application: Spray-in-Air / Select Ultrasonic Stencil Cleaners Concentration: 25% Temperature: Ambient to Rinse: Optional Dry
New Equipment | Solder Materials
KappZapp7R Rosin-cored Solder has rapidly become the audio industry standard for electrical / electronic Copper applications. The 7% Silver solder creates extremely clean conductive joints with high strength, ductility and corrosion resistance. The c
EP-1100 is a one-part adhesive epoxy designed for screen or stencil printing for component attachment, termination and other applications in: hybrid circuits membrane keypads other electromechanical assemblies EP-1100 exhibits excelle
Technical Library | 2014-12-04 18:27:40.0
A review on applications of metal-based inkjet inks for printed electronics with a particular focus on inks containing metal nanoparticles, complexes and metallo-organic compounds. The review describes the preparation of such inks and obtaining conductive patterns by using various sintering methods: thermal, photonic, microwave, plasma, electrical, and chemically triggered. Various applications of metal-based inkjet inks (metallization of solar cell, RFID antennas, OLEDs, thin film transistors, electroluminescence devices) are reviewed.
4 hours Thin Film Set Time (.001" @ 25°C) >12 hours Total % NV Solids 100% Hegman Gauge Volume Resi
Technical Library | 2013-03-07 18:25:36.0
The market for high-layer-count printed circuit boards (PCB) containing blind and buried vias was once relatively small, and focused on specialized applications in the military and high end computing. The demand for these types of PCBs today is being driven by an increasing number of commercial applications in the telecommunications and semiconductor test market segments. These applications typically require high-aspect-ratio plated-through-holes (PTHs) and blind and buried vias in order to meet the applications interconnect density requirements. Blind and buried vias and high aspect ratio PTHs continue to present manufacturing challenges and frequently are the limiting features to achieving high fabrication yield... First published in the 2012 IPC APEX EXPO technical conference proceedings
Innovative Materials, Superior Performance. Our printed circuit board and semiconductor packaging materials provide superior thermal and mechanical performance, a fact we’ve prided ourselves on for over 45 years. All our materials are RoHS complian
