1052 conductive epoxy / ball attach or solder paste results

Influence of Nanoparticles, Low Melting Point (LMP) Fillers, and Conducting Polymers on Electrical, Mechanical, and Reliability Performance of Micro-Filled Conducting Adhesives for Z-Axis Interconnections.

Influence of Nanoparticles, Low Melting Point (LMP) Fillers, and Conducting Polymers on Electrical, Mechanical, and Reliability Performance of Micro-Filled Conducting Adhesives for Z-Axis Interconnections. Influence of Nanoparticles, Low Melting

SMT Express, Volume 3, Issue No. 1 - from SMTnet.com

Optimizing Reflowed Solder TIM (sTIMs) Processes for Emerging Heterogeneous Integrated Packages

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf

solder ball attach for BGA) on TIMs voiding. Fig. 8 below shows an x-ray result after sTIM reflow, then after subsequent SAC reflow (details later). Fig. 8: Reflow#1 vs. Reflow#2 – same part In the case of Heller Industries, the task was to establish the

Heller Industries Inc.

Call for Papers | SMTA International

Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/call_for_papers.cfm

Coating and Potting Connector Assembly to PCB DFX/Design for Six Sigma Direct Chip Attach to PCB (DCA) Dispensing & Underfill Epoxy Fluxes Facility Layout Halogen and Halogen-Free Head on Pillow Defect/Warpage Induced Solder Joint Defects High Melting Point Solder Laser Soldering Leadless Area Array Packages Lead

Surface Mount Technology Association (SMTA)