OEM Precision Casting Pump Body for Water Pump 1. Strict QC & timely delivery 2. Standard: BS, DIN, ASTM 3. Good at custom 4. OEM 1. Material: GGG40. 2. Size: CN150X150mm. 3. Weight: 3.4kg. 4. Technological process: Sand casting+CNC Machining. 5. I
OEM Precision Casting Pump Body for Water Pump 1. Strict QC & timely delivery 2. Standard: BS, DIN, ASTM 3. Good at custom 4. OEM 1. Material: GGG40. 2. Size: CN150X150mm. 3. Weight: 3.4kg. 4. Technological process: Sand casting+CNC Machining. 5. I
Electronics Forum | Tue Sep 01 12:20:47 EDT 2009 | fujiphil
Manually load the board and activate the solenoid for table up/down. Goto I/O then check the status of the sensor. if the sensor was tripped when table is down, removed the pin and check for foreign objects. Or check the hole of the pcb, maybe the si
Electronics Forum | Sun Sep 02 09:06:42 EDT 2018 | davef
Cold resistance between the tip of the tool and the ground reference, tip current leakage, and tip voltage. per ANSI ESD STM 13.1 J-STD-001 Rev G, Appendix “A” Guidelines for Soldering Tools and Equipment: A-2 BENCHTOP AND HAND SOLDERING SYSTEMS Se
Used SMT Equipment | Pick and Place/Feeders
FEATURES ▶Higher productivity and quality with printing, placement and inspection process integration▶For larger boards and larger PCBs up to a size of 750 x 550 mm with component range up to L150 x W25 x T30 mm▶Higher area productivity through dual
Used SMT Equipment | Pick and Place/Feeders
Make: SumsangModel: Decan S1 Details:1.Maximum PCB Handling Size: Standard size is 510x510mm, optional size is 1500x460mm, capable of handling PCBs up to 1500mm(L) x 460mm(W). 2.Mounting Speed: Up to 47,000 CPH (under optimal conditions). 3.Mounting
Industry News | 2003-03-25 08:31:07.0
On completion of the transaction, Flairis will become a wholly-owned subsidiary of Beyonics and its shares will be delisted from Sesdaq.
Industry News | 2021-05-25 12:56:56.0
The SMTA Officer team is excited to provide our members with a free technical webinar on "The Relationship Between Cleanliness and Reliability/Durability" by Debbie Carboni, Global Product Manager at KYZEN Corporation. The presentation will take place on June 10th at 11:00am EST and include:
Technical Library | 2015-12-23 16:57:27.0
The onset of copper barrel cracks is typically induced by the presence of manufacturing defects. In the absence of discernible manufacturing defects, the causes of copper barrel cracks in printed circuit board (PCB) plated through holes is not well understood. Accordingly, there is a need to determine what affects the onset of barrel cracks and then control those causes to mitigate their initiation.The objective of this research is to conduct a design of experiment (DOE) to determine if there is a relationship between PCB fabrication processes and the prevalence of fine barrel cracks. The test vehicle used will be a 16-layer epoxy-based PCB that has two different sized plated through holes as well as buried vias.
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PENANG, MALAYSIA - DECEMBER 2021 ViTrox, World’s Most Trusted Machine Vision Solutions for the semiconductor and electronics packaging industries, announced that it was awarded a 2021 Global Technology Award in the category of Robotic Handling
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Career Center | Duluth, Georgia USA | Management,Sales/Marketing
Over 20 years of experience selling high tech capital equipment for manufacturing. ��Accomplished in territory management, regional sales management, and key account management ��Proficient at managing several projects, coordinating engineering deve
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Project Management, SMT Process Engineering
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/advanced-technology-solutions/semiconductor
) is becoming an important semiconductor packaging technology. As semiconductor device manufacturers further shrink the size and search to reduce the cost of packaged devices, as well as look to increase the number of interconnections (IOs
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
) surface of the die is coated with a conductive compound which, in turn, connects to the surface of a heat sink cooled by forced or natural convection
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