Quick Overview Precision SMT stencil printer for fine pitch with vertical stencil separation Application: MSP-250 series is suitable for mobile phone motherboard, computer motherboards, single and double side PCB, LED display circuit boards, LED
Industry News | 2012-11-06 11:14:19.0
Kyzen recently conducted a benchmarking of its polyimide label materials against Kyzen’s AQUANOX product line.
Industry News | 2023-07-03 19:52:11.0
Heraeus Electronics is excited to announce its participation in SEMICON China, scheduled to take place June 29 - July 1, 2023 at the Shanghai New International Expo Center (SNIEC). Heraeus Electronics will showcase its innovative range of semiconductor packaging materials and printed electronics in booth E7355, Hall E7.
Industry News | 2010-05-12 13:12:33.0
Delivering a robust alternative to high-temperature solder processes, Henkel has developed Hysol ECCOBOND CA3556HF, a silver-filled electrically conductive adhesive designed to offer fast cure at low temperature. The material is ideal for high-throughput production processes and applications that dictate high peel strength, such as the assembly of photovoltaic (PV) modules, automotive sensors and membrane switches that incorporate temperature-sensitive substrates.
Industry News | 2022-01-03 07:25:47.0
Austin American Technology (AAT) will exhibit during the 2022 IPC APEX EXPO, scheduled to take place Jan. 25-27, 2022 at the San Diego Convention Center in California. The AAT team will showcase the redesigned X Series 4.0 Stencil Cleaner in Booth #2109. The X Series is a recipient of the 2021 GLOBAL Technology and 2021 Mexico Technology Awards.
Industry News | 2012-12-17 12:46:38.0
More than 1500 people attended the world leading Printed Electronics USA 2012 event in Santa Clara, CA earlier this month. The event featured 116 exhibitors, up more than 32% on the previous year.
Industry News | 2013-05-01 11:27:08.0
IDTechEx held its Graphene LIVE! tradeshow and conference in Berlin over April 17-18, 2012. This event was co-located with Printed Electronics, TCF LIVE!, Energy Harvesting and Supercapacitor events. It brought together key players from both the supply and end user parts of the value chain.
Industry News | 2020-11-24 00:32:09.0
Cheersonic has committed to the research and development of various ultrasonic equipment for more than ten years. We will design a suitable plan according to the different needs of customers. CENG-S, CENG-M and CENG-L developed by our company is basic , programmable micro material spray coating system.
Industry News | 2009-08-27 14:15:29.0
DENVER — August 2009 — Krayden, Inc., a leading distributor of engineered materials, announces that it will exhibit technologies from key suppliers in booth 1336 at the upcoming Assembly Technology Expo, scheduled to take place September 22-24, 2009 at the Donald E. Stephens Convention Center in Rosemont, IL. Products from Chromerics, Cytec, Dow Corning, FCT Assembly, Humiseal, Huntsman, Henkel/Loctite, Lord, MicroCare Corporation, Permabond, Techcon Systems, and Techspray will be on display in Krayden’s booth.
Industry News | 2009-10-01 12:31:51.0
DENVER — October 2009 — Krayden, Inc., a leading distributor of engineered materials, announces that it will exhibit technologies from key suppliers at the upcoming Space Coast SMTA Expo and Barbeque, scheduled to take place Wednesday, November 4, 2009 from 10 a.m.-3 p.m. at the Lagoon House Education Center in Palm Bay, FL. Products from Chromerics, Cytec, Dow Corning, FCT Assembly, Humiseal, Huntsman, Henkel/Loctite, Lord, MicroCare Corporation, Permabond, Techcon Systems, and Techspray will be on display in Krayden’s booth.
