Industry News | 2012-11-05 14:26:57.0
Caledon Controls announced the launching of a new web site designed to highlight some of the new and innovative advances his company has been making in the printed circuit board industry.
Industry News | 2021-10-07 15:57:22.0
MacDermid Alpha Electronics Solutions will present 'Electronic Materials for Smart, Functional and 3D Automotive HMI Structures' at the Smart Automotive Surfaces Conference on October 7th, in Novi, Michigan USA.
Career Center | San Diego, California USA | Engineering
Kodak - A Design & Product Testing Engineer is responsible for oversight of ink jet printer projects being conducted by the Testing and Customer Assurance area. Oversight includes assurance of the data integrity as well as effective collection, redu
4 hours Thin Film Set Time (.001" @ 25°C) >12 hours Total % NV Solids 100% Hegman Gauge Volume Resi
Industry News | 2011-09-06 14:59:38.0
Engineered Conductive Materials, LLC has appointed Keith Margolin as Formulation Chemist in its Research and Development (R&D) group.
Specifications: 1.Overlay Materials: The most commonly used materials are polyester(PET) and polycarbonate(PC). 2. Rear Adhesive: 3M 467MP, 3M 468MP, etc. 3. Matching color: Pantone and RAL color matching system. 4 .Gloss, semi-gloss or matte 5
Specifications: 1.Overlay Materials: The most commonly used materials are polyester(PET) and polycarbonate(PC). 2. Rear Adhesive: 3M 467MP, 3M 468MP, etc. 3. Matching color: Pantone and RAL color matching system. 4 .Gloss, semi-gloss or matte 5
Industry Directory | Manufacturer's Representative
Specialty materials for SMT Assembly. Solder Paste, Spheres, Tac Fluxes, Flip Chip Fluxes, Solder wi
Industry News | 2019-06-15 22:32:38.0
EMS introduces a revolutionary improvement in durability for printed electronics. EMS inks and adhesives have been designed for compatibility in chemistry and mechanical stress. The unique stack-up design channels paste placement for fillet strength and higher yield with smaller devices.
HTC-300 is designed for screen printing in flex circuit and printed electronic applications where stable resistance values at elevated temperatures are required. Utilizes a high Tg (glass transition temperature) thermoplastic copolymer binder fo
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