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Henkel Electronic Materials

Industry Directory | Manufacturer

Henkel is a manufacturer of materials for PCB and component assembly. The materials include Loctite adhesives, Multicore soldering products, Hysol encaps and underfills, and Power Devices thermal phase change pads.

Engineered Conductive Materials’ Chief Technical Officer to Discuss New ECA Technology at the MWT Back Contact Workshop in Amsterdam

Industry News | 2012-11-02 19:39:20.0

Engineered Conductive Materials, announces that Rich Wells will present “Conductive Adhesives for Back Contact Solar Modules” during the upcoming MWT Workshop, scheduled to take place November 20-21, 2012 at the Nemo Center in Amsterdam, The Netherlands.

Engineered Conductive Materials, LLC

Flexible Hybrid Circuit Fully Inkjet-Printed: Surface Mount Devices Assembled By Silver Nanoparticles-Based Inkjet Ink

Technical Library | 2018-06-27 16:47:13.0

Nowadays, inkjet-printed devices such as transistors are still unstable in air and have poor performances. Moreover, the present electronics applications require a high degree of reliability and quality of their properties. In order to accomplish these application requirements, hybrid electronics is fulfilled by combining the advantages of the printing technologies with the surface-mount technology. In this work, silver nanoparticle-based inkjet ink (AgNP ink) is used as a novel approach to connect surface-mount devices (SMDs) onto inkjet-printed pads, conducted by inkjet printing technology

Universitat de Barcelona

Indium Corporation Expert Presents at SMTA ICSR 2016

Industry News | 2016-04-21 19:00:55.0

Indium Corporation's Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, will present at the International Conference on Soldering and Reliability (ICSR) 2016 on May 9-11 in Toronto, Canada. Sandy-Smith will present How Stencil Design and Reflow Profiles Affect Variation in QFN Voiding Data: A Case Study. This presentation will include data from several studies that demonstrate how stencil design and reflow profile optimization impacts voiding levels and variation in material comparison testing.

Indium Corporation

Engineered Conductive Materials’ Chief Technical Officer to Discuss New ECA Technology at Intersolar North America 2011

Industry News | 2011-06-13 17:29:54.0

Engineered Conductive Materials, LLC announces that Rich Wells will present “Cost Reduction with High Performance Conductive Adhesives for Cell Interconnects” during the Innovation Exchange at the upcoming Intersolar North America, scheduled to take place July 12-14, 2011 at the Moscone Center in San Francisco.

Engineered Conductive Materials, LLC

Henkel Awards Krayden for Its Outstanding Teamwork

Industry News | 2011-11-01 19:36:58.0

Krayden has received an Outstanding Teamwork 2011 Award from Henkel Technologies. The award reiterates Krayden’s ongoing dedication to world-class customer services.

Krayden Inc.

Caledon Controls announces World’s Least Expensive Printed Circuit Board Stunning announcement could change everything

Industry News | 2012-04-27 19:15:46.0

Caledon Controls Ltd. has through a collaborative effort between them, Vast Films and Triangle Labs created the worlds least expensive interconnect structure (PCB).

caledon controls ltd

BTU Announces NextFlex as Its Newest Demo Site for the PYRAMAX Reflow Oven

Industry News | 2017-05-16 18:30:23.0

BTU International today announced that it has installed a PYRAMAX™ 100A demo unit at Silicon Valley-based NextFlex. A public-private consortium of companies, academic institutions, nonprofits and governments, NextFlex’s mission is to advance US manufacturing of flexible hybrid electronics (FHE). With this installation, BTU is now able to provide customer demonstrations on the West Coast, located conveniently in the heart of Silicon Valley.

BTU International

Printed Electronics in East Asia: Change of Direction

Industry News | 2013-05-13 14:06:16.0

Leading analysts IDTechEx find that the total market for printed, flexible and organic electronics will rocket from $16 Billion in 2013 to $77 Billion in 2023. The majority of that is OLEDs (organic and soon to be printed) and conductive ink used for a wide range of applications of printed electronics. This market will experience 14.5% CAGR over the next 5 years.

IDTechEx, Inc.

MacDermid Alpha to Present Next Generation Assembly & Interconect Technologies for 3D In-Mold Electronics at TechBlick 2022

Industry News | 2022-10-04 11:23:40.0

MacDermid Alpha Electronics Solutions will present the technical paper 'Next Generation Assembly and Interconnect Technologies for Smart Structures and Functional Surfaces' at the TechBlick Conference and Expo taking place October 12-13 in Eindhoven, Netherlands.

MacDermid Alpha Electronics Solutions


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