Full Site - : conductive inks (Page 10 of 16)

Flexible OLED lighting developments in East Asia

Industry News | 2013-04-15 14:19:50.0

OLED lighting developments are taking place worldwide, with a lot of the research focused on phosphorescent OLED materials, which have a theoretical luminous efficacy four times higher than fluorescent materials. Last month, Konica Minolta unveiled its new flexible OLED lighting panels at the Lighting Fair 2013 exhibition in Tokyo. The company has developed its own blue phosphorescent materials, enabling it to commercialize the world's first OLED panels using only phosphorescent materials.

IDTechEx, Inc.

Printed Circuit Board

Printed Circuit Board

New Equipment | Test Equipment

Printed Circuit Boards(PCBs) are used to electrically connect electronic components using conductive pathways, traces, etched from copper sheets laminated onto a non-conductive substrate. Our manufacturing processes utilise the latest techniques an

CMD Circuits co., Ltd

Henkel Appoints Jim Wise to Lead Global Sales Efforts for Electronics Assembly Business

Industry News | 2009-05-20 19:48:38.0

In a move designed to further expand the company's market and sales leadership, Henkel Corporation has selected Mr. Jim Wise to direct the global sales effort for its electronics assembly business.

Henkel Electronic Materials

New Wire Bond Encapsulant and Flexible Circuit Bonding Adhesive Now Available for Printer Head and Circuit Assembly Applications

Industry News | 2012-03-30 18:48:18.0

Engineered Material Systems, a leading global supplier of electronic materials for circuit assembly applications, debuts its 357-348 Wire Bond Encapsulant and Flexible Circuit Bonding Adhesive for printer head and circuit assembly applications.

EMS TECHNOLOGY, INC.

Heraeus Printed Electronics and SUSS MicroTec Join Forces to Revolutionize High-Volume Semiconductor Manufacturing with Inkjet Technology

Industry News | 2024-03-11 14:54:34.0

Heraeus Printed Electronics GmbH and SUSS MicroTec have announced the signing of a Joint Development Agreement (JDA) to pave the way for digital inkjet printing of metallic coatings for semiconductor manufacturing. The partnership combines the core competences of both companies to enable digital printing solutions for mass production in the electronics industry for the first time.

Heraeus

Sono-Tek Announces New Product for EMI Shielding Spray Coatings

Industry News | 2022-02-07 17:03:36.0

Sono-Tek Corporation (OTC BB: SOTK) is pleased to introduce a new ultrasonic coating system designed to spray EMI shielding silver inks, FlexiCoat EMI. This emerging market is a natural fit for Sono-Tek's ultrasonic spray technology. At a fraction of the cost of sputtering technology, Sono-Tek ultrasonic spray coating systems have been used as sputtering alternatives where cost savings is a significant concern during manufacturing. Sono-Tek coated EMI shielding components have comparable characteristics to sputtered parts both for adhesion and shielding properties.

SONO-TEK CORPORATION

Kyzen and Polyonics Team Up for PCB Label Durability Study

Industry News | 2012-11-06 11:14:19.0

Kyzen recently conducted a benchmarking of its polyimide label materials against Kyzen’s AQUANOX product line.

KYZEN Corporation

Heraeus Electronics to introduce new advanced solutions to further elevate device performance at SEMICON China 2023

Industry News | 2023-07-03 19:52:11.0

Heraeus Electronics is excited to announce its participation in SEMICON China, scheduled to take place June 29 - July 1, 2023 at the Shanghai New International Expo Center (SNIEC). Heraeus Electronics will showcase its innovative range of semiconductor packaging materials and printed electronics in booth E7355, Hall E7.

Heraeus

New Henkel Electrically Conductive Adhesive Cures Fast at Low Temperature; Ideal for Photovoltaic, Automotive and Membrane Switch Applications

Industry News | 2010-05-12 13:12:33.0

Delivering a robust alternative to high-temperature solder processes, Henkel has developed Hysol ECCOBOND CA3556HF, a silver-filled electrically conductive adhesive designed to offer fast cure at low temperature. The material is ideal for high-throughput production processes and applications that dictate high peel strength, such as the assembly of photovoltaic (PV) modules, automotive sensors and membrane switches that incorporate temperature-sensitive substrates.

Henkel Electronic Materials

Austin American Technology to Bring Award-Winning X Series 4.0 Stencil Cleaner to APEX

Industry News | 2022-01-03 07:25:47.0

Austin American Technology (AAT) will exhibit during the 2022 IPC APEX EXPO, scheduled to take place Jan. 25-27, 2022 at the San Diego Convention Center in California. The AAT team will showcase the redesigned X Series 4.0 Stencil Cleaner in Booth #2109. The X Series is a recipient of the 2021 GLOBAL Technology and 2021 Mexico Technology Awards.

Austin American Technology


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