Industry Directory | Consultant / Service Provider
CAD Design Software products run in the AutoCAD environment.
Industry Directory | Consultant / Service Provider
EDA-US, Inc. is a one stop shop for your design needs. From schematic capture to prototype development, EDA-US looks forward to working with you. For a quote or more information please email sales@eda-inc.us
New Equipment | Fabrication Services
HDI PCB Manufacturer & Assembly – One-stop services from China -HDI (high-density interconnection board) is a compact circuit board designed for small capacity users. Compared with ordinary PCB, the most significant feature of HDI is that the wiri
New Equipment | Test Equipment
KOH YOUNG ZENITH 2 3D AOI 8 directional projection light system Camera resolution: 8M 15μm maximum Height measurement: 10 mm Max PCB 490 x 510 mm weight: 600kg Dimension: 1000x1295x1627 mm KOH YOUNG ZENITH 2 3D AOI KOH YOUNG ZENITH 2 3D AOI R
Electronics Forum | Wed Sep 21 20:03:34 EDT 2005 | kevinbooth
I am going to agree with Rob a little. It is also possible that a internal ground plane might be under or connected to the pads of this cap thus causing a increase in temp to this part during reflow. This can cause parts on occasion to jump from the
Electronics Forum | Mon Apr 01 12:07:25 EST 2002 | slthomas
* What material are you using? Loctite 3609 * What is your cure profile? In excess of the 90-120 seconds at 150C that Loctite recommends. * Dot dimensions and tip? 27g. conical tipped needle for the 0603's. I started with a 14 mil dot which loo
Used SMT Equipment | Repair/Rework
Warranty: 90 days parts & labor against manufacturing defects - wear items not included 1IR550A000A67 1 PC IR550A Infrared Rework System - 115V/US 1600 W heating power -800 W bottom side - 135 x 260 mm -800 W top side - 60 x 60 mm 1 K-type themoco
Used SMT Equipment | In-Circuit Testers
JDSU FST-2802-V6 Acterna Ethernet and Fibre Channel services module with FST2000 TestPad The FST2802 is a handheld Ethernet, Fibre Channel, and IP services test instrument designed to meet the needs of service providers for turning up and troub
Industry News | 2013-06-26 09:09:19.0
The SMTA announced Harald Grumm from Christian Koenen GmbH as the recipient of the Best of Conference Award for his presentation “The Potential of Stencil Technology – Choosing the Right Stencil Options to Maximize Yield and Earnings” at the 9th Annual International Conference on Soldering and Reliability, held May 14-17, 2013 at the Sheraton Toronto Airport, Ontario, Canada.
Industry News | 2018-10-18 09:02:41.0
How to Solder a Surface Mount Device to a PCB Pad
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Parts & Supplies | Pick and Place/Feeders
JUKI PX-5000620-00 Vacuum Pad 40000685 JUKI 2060 X-axis motor 40000747JUKI2060 Y axis tank chain 40001932JUKI2050XY adapter card (original brand new) 40001953Juki2050 control panel (original second-hand) 40042257 JUKI2000 KE760 sealing ring 4
Parts & Supplies | SMT Equipment
N610004066AA NOZZLE-KIT N610004072AA TARGET-NS KXFB01C0B00 CASE N610004073AA JIG-NOZZLE N610004074AA NOZZLE-KIT KXFY00A3A00 JIG KXFB043YA01 JIG-WORK KXFB043MA00 PLATE KXFA1KUAA01 GUIDE KXFB043NA00 CASE KXF0DXJ7A00 SPACER KXF0DX0ZA00 KNOB
Technical Library | 2018-06-27 16:47:13.0
Nowadays, inkjet-printed devices such as transistors are still unstable in air and have poor performances. Moreover, the present electronics applications require a high degree of reliability and quality of their properties. In order to accomplish these application requirements, hybrid electronics is fulfilled by combining the advantages of the printing technologies with the surface-mount technology. In this work, silver nanoparticle-based inkjet ink (AgNP ink) is used as a novel approach to connect surface-mount devices (SMDs) onto inkjet-printed pads, conducted by inkjet printing technology
Technical Library | 2023-01-06 16:09:03.0
The 4-14 IPC Standards Committee recently created a revision to the IPC4552 specification for Electroless Nickel/Immersion Gold (ENIG) finished Printed Circuit Boards (PCB). Revision A brings a more comprehensive evaluation of metal layer thicknesses measurement, composition and introduces, for the first time, a quality aspect for nickel corrosion which has been historically connected to a defect called black line nickel or black pad.
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
00359433-01 Reflection Light Barrier, configured 00359434-01 Crash Light Barrier,configured 00359435-01 Neutral Position Light Barrier 00359436-01 Unlock Device WTC 00359438-01 Connection Cable: Power MTC 00359459-01 LIFTING TABLE SINGLE CONVEYO
Training Courses | ON DEMAND | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Events Calendar | Wed Dec 06 00:00:00 EST 2017 - Wed Dec 13 00:00:00 EST 2017 | Rolling Meadows, Illinois USA
X-Ray of PCBs Webtorial
Career Center | Toronto, Ontario Canada | Production,Quality Control,Technical Support
HIGHLIGHTS OF QUALIFICATIONS • Over 5 years of experience working as a Technical Support person, Onsite Technician in maintenance and operation of business environment to support business such as inventory of equipments and supplies as well as softw
Career Center | Senai, Johor Malaysia | Engineering,Production,Quality Control
A Six Sigma Green Belt practitioner with high experience in process,quality and production engineering.
SMTnet Express, August 13, 2015, Subscribers: 23,186, Members: Companies: 14,558 , Users: 38,745 Pad Cratering Susceptibility Testing with Acoustic Emission Wong Boon San, Julie Silk; Agilent Technologies | Richard Nordstrom, Ph.D.; Acoustic
| https://www.eptac.com/soldertips/soldertips-issues-with-incomplete-solder-reflow-in-production-2/
interface and this is a defective condition. The reasoning of why this may be happening on only a few pads of a particular component is most likely due to the heat sinking characteristics of the pad/land area
Blackfox Training Institute, LLC | https://www.blackfox.com/4-common-errors-in-smt-assembly/
process, eventually reducing the likelihood of these errors. 1. Bridging Solder bridging happens when a solder accidentally connects two electrical conductors that should not be connected, often resulting in a short circuit
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