Electronics Forum | Wed Jun 30 11:07:16 EDT 1999 | Earl Moon
| | | | | | | | | | snip | | | | | | | | | | | John and Dave, | | | | | | | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable research (as others of us d
Electronics Forum | Sat Jan 19 02:25:37 EST 2002 | ianchan
Hi, Have a board run, using 63/37 Water Souble (WS) process. during the reflow setup time, we had unsolder issues on a leadless bump chip carrier (BCC) IC level package. To rectify the unsolder rejects, we adjusted the reflow time from 25-55sec into
Electronics Forum | Tue May 23 20:44:13 EDT 2000 | Dave F
Sal: You and Wolfgang are spot on, but let's see if we can blow this out a bit. Before proceding to rattle on ... � PC Card. A credit card-size computer peripheral that add memory, mass storage, and I/O capabilities to computers in a rugged, compa
Electronics Forum | Sat Dec 16 10:03:32 EST 2000 | Dave F
Castellation. A recessed metalized feature on the edge of a leadless chip carrier [LCC] that is used to interconnect conducting surface or planes within or on the chip carrier. If you search the fine SMTnet Archives, you find: * A fine thread [cast
Electronics Forum | Fri Sep 17 09:54:40 EDT 1999 | Brian
| | | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a
Electronics Forum | Fri Sep 17 10:09:17 EDT 1999 | Earl Moon
| | | | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However,
Electronics Forum | Wed Jun 30 17:52:06 EDT 1999 | JohnW
| | | | | | | | | | | | | | | | snip | | | | | | | | | | | | | | | | | John and Dave, | | | | | | | | | | | | | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on cons
Electronics Forum | Wed Jun 30 15:24:23 EDT 1999 | Earl Moon
| | | | | | | | | | | | | | snip | | | | | | | | | | | | | | | John and Dave, | | | | | | | | | | | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable res
Electronics Forum | Wed Jun 30 13:48:57 EDT 1999 | JohnW
| | | | | | | | | | | | snip | | | | | | | | | | | | | John and Dave, | | | | | | | | | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable research (as ot
Electronics Forum | Tue Jan 18 12:36:11 EST 2000 | Dave F
Dave: I haven't located something to support your contention, yet, and I'm not going to comment on the factors that drive reliability beyond component selection, because I know that you've got some sweaty-palmed sales type wringing his hands waiting
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