Electronics Forum | Wed Aug 21 09:09:50 EDT 2013 | wcheew
I am having solder barrel fill issues on THM component, we follow, we follow IPC 610 E requirement. The barrel fill issues happen on signal & ground pin at connector & E-cap. I found out that most of the insufficient solder happen on the connector ag
Electronics Forum | Thu Feb 10 11:40:25 EST 2005 | Carol
Hello All, Can somebody direct me to a facility or school or even a business that can offer an x-ray course for Class 3 electronic circuit board population interpretation, as in BGA ball acceptance, connector solderability fill acceptance etc.? Some
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