Technical Library | 2008-03-25 18:15:54.0
Thin film thermoelectric devices offer a fundamentally new operating regime for integrated, active cooling solutions and localized thermal management, yet the assembly methodology used to implement these devices is fully compatible with existing surface mount approaches. In order to take advantage of these unique characteristics, thin film thermoelectric devices need to be designed for the appropriate thermal and form-factor environments, with system-level constraints carefully considered as an integral part of the overall design process.
Technical Library | 2011-09-08 13:46:10.0
Anisotropic Conductive Adhesive Bonding is an interconnection technique mostly used for connecting displays to pcb’s using anisotropic conductive adhesive and flex foils. For successful implementation there are a few basic constraints. If these are followed, display connection is a simple and reliable process, giving top quality connections. Heat-Sealing can be done in any factory and can be introduced in a few months, from start of design to mass productions
Technical Library | 2017-09-13 00:20:21.0
The objective of the study is to examine the relationship between energy-resource depletion, climate change, health resources and the Environmental Kuznets Curve(EKC) under the financial constraint environment in the panel of selected developed countries, over the period of 2000–2013.
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Industry Directory | Association / Non-Profit
An association of member companies cooperating on research in key areas of semiconductor technology, with a strong focus on thin-film photovoltaic (PV) manufacturing.
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