Industry News | 2003-05-06 09:05:12.0
New Schematic Capture and Simulation Software Delivers Innovative Features and the Industry�s Best Price/Performance
Industry News | 2022-04-06 12:02:37.0
Seika Machinery, Inc. is pleased to offer a wide range of Sawa ultrasonic cleaners. From portable, manual stencil cleaners to fully automatic systems like the Sawa Ecobrid cleaner that can clean and dry in just six minutes, there is a solution for any cleaning application including removal of particulates from nozzles, squeegees, pallets, misprints and other parts.
Parts & Supplies | SMT Equipment
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New Equipment | Test Equipment - Bond Testers
Fully integrated solution for automated wafer testing (up to 300 mm). The Condor Sigma W12 is specifically designed for precision shear testing and Cold Bump Pull (CBP) on wafer or at wafer level. The system has the largest X/Y and fastest stages av
Industry News | 2011-05-23 15:18:31.0
Everett Charles Technologies’ Contact Products Group (ECT-CPG) announces the appointment of QTEK Mexico as its distributor for the Mexico interior region.
The Condor Sigma W12 is specifically designed for precision shear testing and Cold Bump Pull (CBP) on wafer or at wafer level. The system has the largest X/Y and fastest stages available in the industry, to reach all positions on the wafer with the t
Industry News | 2011-02-23 20:02:51.0
Everett Charles Technologies’ Contact Products Group (CPG) has been awarded US Patent Number: 7,862,391for its ZIP® family of flat technology Pogo® pins.
Industry News | 2012-02-03 12:58:42.0
BPM Microsystems will debut its new production solution for in-system device programming in Booth #3702 at the upcoming IPC APEX Expo.
Industry News | 2012-03-19 20:04:03.0
Everett Charles Technologies’ (ECT) has appointed Hidenori Onodera as its new Business Development Manager overseeing the company's new business development activities in Japan.
Industry News | 2012-04-27 13:44:41.0
BPM Microsystems will demonstrate its new in-system device programming solution in Hall 7, Stand 648 at the upcoming SMT Hybrid Packaging Exhibition, scheduled to take place May 8 - 10, 2012 at the Exhibition Centre Nuremberg in Germany.
