Industry News | 2013-05-21 22:12:09.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2013 Global Frost & Sullivan Award for Market Share Leadership.
Industry News | 2014-09-06 19:18:17.0
Briefing Co-hosted by IPC as Part of Continuing Effort to Connect IPC Members with Policymakers.
Industry News | 2016-06-22 15:33:28.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2016 Global Frost & Sullivan Award for Growth Excellence Leadership. Heller Industries has made remarkable improvements to its product and technology portfolios over the last 10 years to emerge a top participant in the SMT reflow soldering equipment market.
Industry News | 2013-01-11 17:04:51.0
GPD Global will exhibit in Booth #739 at the upcoming Strategies in Light conference and exhibition, scheduled to take place February 12-14, 2013 at the Santa Clara Convention Center in California.
Industry News | 2012-09-13 09:35:40.0
GPD Global will exhibit in Booth #435 at the upcoming SMTA International Conference and Expo,
Industry News | 2013-01-16 19:22:48.0
GPD Global will exhibit in Booth #2633 at the upcoming IPC APEX EXPO. Live demonstrations will be given for a number of systems from the company's dispensing line.
Industry News | 2012-06-11 12:24:54.0
GPD Global announces that it will exhibit in Booth #6085 North at the upcoming SEMICON West conference and exhibition, scheduled to take place July 10-12, 2012 at the Moscone Center in San Francisco, California.
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Electronic manufacturing services - electronic design, development and manufacturing. Circuit board design, prototyping, FPGA services, signal integrity and simulation, pcb assembly. Factories in California USA and Malaysia.
Manufacturer / Consultant / Service Provider
3240 Scott Blvd
Santa Clara, CA USA
Phone: +1 408 980 0400
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