Electronics Forum | Wed Nov 04 07:53:56 EST 2009 | tstrat
The phosphorous concentration was not elevated w.r.t. levels needed for black pad syndrome. It is not via-in-pad. The component on the board that has been failing is just a standard BGA.
Electronics Forum | Wed Jun 13 20:38:23 EDT 2012 | kahrpr
It is possible that there is nickel contamination in the gold. Depending on your plating board vendors put nickel down first. The plating also could be to thin. Dave had a good suggestion in trying to solder the pad with a Iron that will tell a lot.
Electronics Forum | Wed Sep 20 14:19:26 EDT 2000 | Jason Wraight
I am sure that this is a problem that will never be solved, but something that I am seeing in increased numbers. Often refered to as "Black Pads". After production, returns from the field coming back with contaminated pads under various components.
Electronics Forum | Tue Sep 01 11:30:28 EDT 2009 | rgduval
Is the solder wetting to the pad, and not to the part? If so, and all other things being true (same process, profile, solder), we'd suspect some contamination on the part preventing solder from wetting to the part. This could be tested by attemptin
Electronics Forum | Thu Apr 17 10:44:24 EDT 2008 | rculpepp
I'd suspect contamination also, possibly from the board supplier. Sr. Tech's post mentioned what looks like a blister on the board, in the upper right of the Q19 photo. This could very well be a contaminate from the PWB fab shop. I've seen similar pr
Electronics Forum | Wed Aug 18 11:18:22 EDT 1999 | GREG DENHAM
WE ARE CURRENTLY HAVING PROBLEMS REFLOWING BOARDS WITH WHITE TIN PLATING. WE ARE NOT GETTING GOOD WETTING ON THE PADS. WE HAVE CHECKED THE REFLOW PROFILE AND TRIED DIFFERENT PASTE'S. WE THINK THERE MAY BE CONTAMINATION OR OXIDATION ON THE PADS. IS TH
Electronics Forum | Wed Aug 18 11:25:12 EDT 1999 | J.J. Thomas
| WE ARE CURRENTLY HAVING PROBLEMS REFLOWING BOARDS WITH WHITE TIN PLATING. WE ARE NOT GETTING GOOD WETTING ON THE PADS. | WE HAVE CHECKED THE REFLOW PROFILE AND TRIED DIFFERENT PASTE'S. | WE THINK THERE MAY BE CONTAMINATION OR OXIDATION ON THE PADS.
Electronics Forum | Tue Jun 16 19:41:46 EDT 2020 | emeto
Voids form mainly two ways. 1. Contamination - due PCB pads/part leads oxidation, wetting on the pad is bad forming void(these are usually borders with SMT pad - peripheral) 2. Process formed. These are in the center of the solder joint - could n
Electronics Forum | Sun Aug 23 07:03:09 EDT 2009 | ghepo
OK Eric, is difficult answer at distance without examine the PCB..., anyway in my opinion the problem is the PCB quality. There are two possibility : the crack is between solder and nickel or is between nickel and pad copper. In both situation the
Electronics Forum | Thu Aug 24 13:20:24 EDT 2000 | Murad Kurwa
One of our divisions is having this problem: - De-wetting on the smt pads and componenent termination on the bottom side after top side procssed through reflow. Board finish is immersion silver. ? Any recommendation on what we should check & verify
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