Full Site - : contamination golden pad (Page 16 of 41)

Unsoldered gold pads on unleaded wave solder process

Electronics Forum | Fri Jun 15 11:22:14 EDT 2012 | hegemon

Good info above from davef Solder pot contamination seems likely, are you using any dross reducers or additives that might be reacting with this particluar batch of PWBs? 'hege

Modems reflow mistake

Electronics Forum | Mon Oct 12 14:30:58 EDT 2015 | duchoang

Hello Eniac, 1/- Insufficient solder paste, check your print (Printer/Stencil). 2/- If you've got good paste deposit, that could be contaminated pads causing poor solderability. Good luck.

ENIG (thru hole ring turns black after wave soldering)

Electronics Forum | Mon Aug 22 22:40:52 EDT 2016 | twhoo

analysis report is as attached. Pls let me know what you think of the root cause of this issue? Can i conclude this is a black pad at thru hole ring with a root cause of contaminated gold

Reflow soldering issue

Electronics Forum | Fri Aug 24 12:59:03 EDT 2018 | cupet

Dear davef, but this LED is skip component, that's a blank footprint and one of its pad is badly wetted...this is the reason for my thinking about contamination. Do you mean different solder paste with more aggressive flux?

LED lifted soldering defect

Electronics Forum | Thu Dec 26 12:41:53 EST 2019 | emeto

We agree with your statements. 1. Having manually printed board will compromise your print and you don't know how much paste you have on each pad. 2. LEDs falling off that easily might be related to contamination, considering that your profile is not

SOLDER SHORT DUE TO VOID IN BGA

Electronics Forum | Wed Jul 08 02:50:30 EDT 2020 | rsatmech

Hi DucHoang, Thanks for the response. I will share the images. We are using OSP boards and issue is not at particular BGA. Can you suggest me any methods to identify the pad contamination.

Re: REFLOWING WHITE TIN PLATED PADS

Electronics Forum | Wed Aug 18 12:35:41 EDT 1999 | Earl Moon

| | WE ARE CURRENTLY HAVING PROBLEMS REFLOWING BOARDS WITH WHITE TIN PLATING. WE ARE NOT GETTING GOOD WETTING ON THE PADS. | | WE HAVE CHECKED THE REFLOW PROFILE AND TRIED DIFFERENT PASTE'S. | | WE THINK THERE MAY BE CONTAMINATION OR OXIDATION ON THE

Solder on gold finger

Electronics Forum | Thu Jul 20 05:04:30 EDT 2006 | bing007

We had a similar problem with gold contact pads. Cleanliness is paramount. If you are using foil tensioning system, wash the foil in a stencil wash before use as the cardboard cassettes may be contaminated. Be very careful when loading into a frame f

BGA drop off from the boards

Electronics Forum | Fri May 23 09:27:37 EDT 2014 | emeto

Hello, these pads look so clean.....I am not sure you had a good solder connection there. I would check the following. 1. Is the part RoHS in a lead process 2. X -ray boards after reflow(I assume you will see head in pillow) 3. Check for board con

Re: BGA problem: open after reflow

Electronics Forum | Mon Nov 06 09:38:55 EST 2000 | Dean Stadem

We have seen this problem several times. It always goes back to pad solderability, very seldom does it have anything to do with ball size. If there is no evidence of wetting on that pad, but all of the other pads did solder, you need to ask yourself


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