Electronics Forum | Mon Nov 30 23:45:20 EST 1998 | Kallol Chakraborty
Hi folks , Lately we are seeing a lot of rawcards with black spots on the pads - most of them have Au finish(immersion gold) . We did a lot of inspecton after wave solder and found that only (fine pitch) QFP are affected the most. Our inspection /te
Electronics Forum | Wed Jan 09 18:17:15 EST 2002 | Chris
I don't have a plasma cleaner either. It will help a lot. Actually I don't clean at all. Our wirebond pads are far enough away so the flux residue does not get on the wirebond pads. That's what we think anyway. I am sure we have some degree of c
Electronics Forum | Tue Jul 07 05:55:34 EDT 2009 | kpm135
I agree with your assessment of the two pins with irregular solder. The head-in-pillow or broken joint are both probable events for your defect. At this point in the process it will probably be difficult to pinpoint the exact cause. If it was a broke
Electronics Forum | Thu Sep 10 15:06:11 EDT 2009 | dyoungquist
My guess is that he is talking about the gold plated pads not fully wetting with solder. We have seen this on some of our ENIG boards with the gold still showing at the far corners of the rectangular pads. Not knowing if this is hand soldering or p
Electronics Forum | Thu Oct 08 11:33:16 EDT 2009 | cab
We are currently wirebonding MCMs with surface components located in very close proximity to wirebond pads, which are gold plated. We are ball bonding with 99.99% Au wire. Normally we do not have problems, however if product has been reflowed seve
Electronics Forum | Thu Aug 31 04:56:44 EDT 2023 | auriga2001
I would start with the following possibilities and solutions: Add extra solder to the pads with a Camalot dispenser; or preformed solder slugs placed as an additional component if there is enough extra pad to attach it without interfering with compo
Electronics Forum | Tue Jun 04 12:54:00 EDT 2002 | Bob
Hi, We are manufacturing a small PCB with large areas of gold plating. We experience from time to time what appear to be solder splashes on the gold areas. I do not believe the contamination to be from "outgassing" due to the distance from the dep
Electronics Forum | Wed Sep 18 22:53:24 EDT 2002 | davef
Please give us background on your situation, so that we can focus on the specifics, for instance: * This is a bare board problem, correct? Then, this contamination causes what the problems in your process? * What is the type [ie, FR4, CEM1, etc] of
Electronics Forum | Wed Nov 06 10:03:59 EST 2013 | rgduval
Hi, Peter, I'm not an authority on surface finish thickness, and it's effect on reflowing, so, I can't advise on that front. If the boards are a week old, and ENIG, I would not suspect surface contamination. It's always a consideration, of course,
Electronics Forum | Thu Feb 14 23:37:38 EST 2008 | operator
That is bizarre. I would have to say that you need to do a test on the PCB to test solderability with an iron like mentioned before. If you don't find that the pads are contaminated or masked over lightly and the pads do take solder effortlessly, you
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