Electronics Forum | Wed May 28 19:21:09 EDT 2014 | hegemon
Just from the look of things (a picture) I would first guess it is a contamination problem on the PWB. Check over all your handling practices. Make sure the PWBs are NEVER touched by bare hands. I would not rule out the Black Pad phenomena, but i
Electronics Forum | Thu May 03 10:14:10 EDT 2001 | davef
Now, I'm not going to talk solder balls, in a traditional sense. I have an image of bilbous, globs of excess solder near the ends of PTH leads. If that's not what you have, ignore the following [and help us understand your situation better] ... Yo
Electronics Forum | Tue Nov 05 18:17:00 EST 2002 | russ
This sounds like a contamination issue with the HASL finish.(solder on lead but not on pad). I have experienced this before and it was related to the HASL process at our supplier. They found some type of contaminate in the bath (unfortunately I can
Electronics Forum | Fri Dec 03 13:08:40 EST 2004 | Dreamsniper
The voids are between the interface of the pad and the solder joint of component chips. I have a good thermal profile and this problem occured only on certain product so since we have some common components, component termination contamination is no
Electronics Forum | Wed Aug 27 14:19:40 EDT 2008 | grics
Have you given this information to your paste manufacturer???(Profile, Pics of defects?) The profile seems to look ok(without knowing paste info...) I think the ramprate looks a little aggressive but it could be the scaling of the profile and the i
Electronics Forum | Fri Apr 29 14:16:16 EDT 2011 | ppcbs
Below is the long explanation. This defect is most commonly found with BGA components, but can arrise with all components. I see it happening more now with lead free boards that are being assembled with a no clean flux. Best short term remedy is t
Electronics Forum | Wed Jul 26 10:06:19 EDT 2000 | Doug Philbrick
I have read many of the past threads on both topics and I still am not convinced I know the answer to the soldering problem we are encountering. I am hopping someone can help. I have a dense SMT board we are building and have been building for some
Electronics Forum | Sat Mar 25 12:13:13 EST 2000 | JAX
Robert, Have you checked for any form of contamination that might cause the solder not to adhere to the balls? From the pictures you have on the net it appears that you have too much solder on the pads. What thickness is your stencil? If it is to sp
Electronics Forum | Mon Feb 26 09:36:08 EST 2001 | blnorman
ASTM E 443 is a test for sulfur by Oxygen Flask Combustion. Other instruments will detect sulfur (I assume a SEM with EDS capability will pick up the sulfur). We had an addition cure silicone potting compound inhibition problem last year that was t
Electronics Forum | Mon Feb 07 13:00:06 EST 2000 | Jose RG
Hi, Last Friday, we had a new defect in our line. We found a nice and shiny solder fillet completelly attached to some component leads (in a SPLCC 84) but the solderjoints were not solder to the pads. (Hasl finishing) Any idea ?? Some contamination
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