Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Dinghua Technology-- the leading manufacturer of BGA rework station, Automatic screw locking machine, Automatic soldering station and non-standard equipment. For more details, please just contact John, WhatsApp/Wechat:+86 1576811 4827 , Skype: si
Industry News | 2001-02-26 11:18:45.0
Innovative Flextac Stencils simplify BGA rework. These self-sticking laser cut, polymer solder paste stencils use a residue-free adhesive similar to Post-it Notes to seal around BGA pads to ensure that solder paste will not bleed under the stencil when the paste is applied. Disposable Flextac Stencils are easy to use and will not leave any residue on the board surface.
Industry News | 2021-05-24 04:37:04.0
HVAC stands for heating, ventilation, and air conditioning. This system provides heating and cooling to residential and commercial buildings. These systems use fresh air from the outdoors to provide high indoor air quality. The V in the HVAC or ventilation is the process or replacing or exchanging air within a space.
New Equipment | Education/Training
Bob Willis has an extensive range of training videos available online. The complete video collection is available to view online for a fixed fee, based on a six month period. After purchase you are provided with links to each of the online videos for
Industry News | 2015-04-28 18:03:55.0
KYZEN is pleased to announce that it will present at the Toronto SMTA Expo & Tech Forum, scheduled to take place Thursday, May 21, 2015 at the Hilton Toronto/Markham Suites Conference Centre in Markham, ON. Dr. Mike Bixenman will present the paper titled “How Clean is Clean Enough?”
Industry News | 2022-04-28 14:58:03.0
Magnalytix, the forefront driver in providing real-time reliability solutions for electronics manufacturing, is thrilled to announce that Co-Inventor Dr. Mike Bixenman will present "Electrochemical Reliability of 2-D and 3-D Models as a Function of the Electrical Field Effects" on Tuesday, May 17, 2022, at the Park Plaza Victoria in Amsterdam from 3:30-4 p.m.
Industry News | 2008-11-25 16:50:00.0
Release Date: 1-Nov-2008
Industry News | 2019-08-19 15:02:03.0
YINCAE has successfully developed a new No Clean Flux product -NC 256 with zero flux residue, excellent soldering wetting and eliminates the cleaning process. NC 256 has been designed not only for wafer ball bumping and other ball bumping such as CSP, BGA, Flip chip and PoP (package on package), particularly for lead free applications, but also for flip chip, CSP, BGA and other advanced components attachment to eliminate cleaning process.
Industry News | 2017-04-22 11:38:03.0
Specialty Coating Systems (SCS) is pleased to announce that it will exhibit at the 2017 IMAPS Micro/Nano-Electronics Packaging and Assembly (MiNaPAD) Forum, scheduled to take place May 17-18, 2017, in Grenoble, France, at the WTC congress center. The company will exhibit its industry-leading Parylene conformal coatings and SCS Vice President of Technology Rakesh Kumar, Ph.D. will present, “Parylene Nanostructures and Coatings for Electronics Applications.”
Golden State is a contract manufacturer that makes wire harnesses, electromechanical assemblies (box builds, subassemblies, PCBAs, kits, etc.) and services (sorting, rework, value additive manufacturing engineering)
18220 Butterfield Blvd
Morgan Hill, CA USA
Phone: 5102268155
