Industry News | 2019-08-19 15:02:03.0
YINCAE has successfully developed a new No Clean Flux product -NC 256 with zero flux residue, excellent soldering wetting and eliminates the cleaning process. NC 256 has been designed not only for wafer ball bumping and other ball bumping such as CSP, BGA, Flip chip and PoP (package on package), particularly for lead free applications, but also for flip chip, CSP, BGA and other advanced components attachment to eliminate cleaning process.
Industry News | 2017-04-22 11:38:03.0
Specialty Coating Systems (SCS) is pleased to announce that it will exhibit at the 2017 IMAPS Micro/Nano-Electronics Packaging and Assembly (MiNaPAD) Forum, scheduled to take place May 17-18, 2017, in Grenoble, France, at the WTC congress center. The company will exhibit its industry-leading Parylene conformal coatings and SCS Vice President of Technology Rakesh Kumar, Ph.D. will present, “Parylene Nanostructures and Coatings for Electronics Applications.”
Industry News | 2019-05-16 01:27:23.0
There are several surface treatment for PCB board: bare board (no treatment on the surface), rosin board, OSP (Organic Solderability Preservatives), HASL (lead tin, lead-free tin), plating gold, immersion gold, etc., these are relatively conscious treatment. Many people can't tell the difference between plating gold and immersion gold, thinking that it is the same thing, it is a big mistake. The following is a brief introduction to the difference between plating gold and immersion gold.
Industry News | 2018-02-01 20:18:01.0
Nordson MARCH introduces the MesoSPHERE™ Plasma System for very-high throughput processing of 3D and wafer-level packaging processes such as fan-in, fan-out, wafer-level, and panel-level -handling wafers up to 450mm and panels up to 480mm. The MesoSPHERE's new, patented W3 three-axis symmetrical plasma chamber ensures that all areas of the wafer are treated equally and uniformly. Tight control over all process parameters gives highly repeatable results.
Industry News | 2018-10-18 08:21:10.0
How to Prevent Non-Wetting Defect during the SMT Reflow Process
Industry News | 2013-04-15 15:16:28.0
Ascentech LLC, North American Distributor for UK-based Aprotec Instrumentation, announces the availability of the Aprotec Z-Check family of solder paste inspection and measurement systems. Z-Check systems are easy-to-use benchtop non-contact SPI measuring systems capable of meeting the needs of today's demanding PCB production and assembly environment.
Industry News | 2013-06-27 08:49:03.0
Chester, Connecticut, USA – Ascentech LLC, North American Distributor for UK-based Aprotec Instrumentation, announces the availability of the Aprotec Z-Check family of solder paste inspection and measurement systems. Z-Check systems are easy-to-use benchtop non-contact SPI measuring systems capable of meeting the needs of today’s demanding PCB production and assembly environment.
Industry News | 2018-01-16 11:59:10.0
Vision Engineering has teamed up with industry-expert Bob Willis to broadcast a free Electronics Academy Webinar aimed at identifying the issues affecting PCB/SMT assembly and the challenges of achieving Zero Defect Manufacture. The next webinar, Eliminate Printed Circuit Board Problems & Failure Modes will take place on January 23rd at 2:30 EST.
Industry News | 2013-11-08 19:18:10.0
Gen3 Systems will exhibit with its distributor, Stannol, in Hall A4, Stand 470 at the productronica International Trade Fair.
Industry News | 2018-03-07 07:37:28.0
Nordson MARCH announces that it has received a 2018 New Product Introduction (NPI) award in the Surface Treatment category for its new-generation RollVIA™ plasma system. The system is used for plasma applications such as surface activation for improved adhesion, carbon removal and descum/desmear for cleaner surfaces, and etchback, which removes a slight amount of dielectric contamination between internal copper planes during printed circuit board (PCB) production. The RollVIA provides uniform plasma treatment of substrates as thin as 25 microns.
Golden State is a contract manufacturer that makes wire harnesses, electromechanical assemblies (box builds, subassemblies, PCBAs, kits, etc.) and services (sorting, rework, value additive manufacturing engineering)
18220 Butterfield Blvd
Morgan Hill, CA USA
Phone: 5102268155
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