Electronics Forum | Wed Nov 15 07:21:58 EST 2017 | stephendo
You don't clean contaminated gold fingers so much as you replace them. I once had the "cleaning" solution. It totally dissolved the gold fingers so that they could be replaced.
Electronics Forum | Mon Nov 13 13:49:16 EST 2017 | slthomas
Preemptively you can apply Kapton tape to protect the gold fingers during reflow. I think that's what most people do. After the fact, there are services available to clean them up but as it was described in another thread here, it is not in-expensiv
Electronics Forum | Mon Nov 13 21:27:02 EST 2017 | slah6678
Hi, thanks for reply. Kapton tape is costly and it may create another handling issue. BTW can you share the thread for the cleaning process ?
Electronics Forum | Mon Nov 13 21:31:11 EST 2017 | slah6678
Hi David, thanks for reply We did doing some study, most properly this problem was due to reflow process. Any thing that we can do for the reflow profile ? slow down the ramp up rate or .....
Electronics Forum | Tue Nov 14 15:48:18 EST 2017 | slthomas
Yes, thanks for bringing up that point, DaveF. All polyimide tapes are not created equal, and in my experience Kapton has always worked for this application. The "better deal" has not, ever.
Electronics Forum | Mon Nov 13 14:58:56 EST 2017 | davef
Determine the origin of the solder * Sloppy paste printing technique * Lax stencil underside cleaning practices * Sloppy misprint cleaning practices * Poor part placement practices creating solder balls * Poor material control allowing solder p
Electronics Forum | Tue Nov 14 08:52:07 EST 2017 | davef
If you think the problem is occurring in the box and it is wide spread, consider replacing your solder paste with your paste supplier. There are paste formulations aimed at the solder balling issue that some LF pastes create. On tuning your reflow r
Electronics Forum | Thu Nov 03 21:40:40 EST 2005 | davef
There maybe multiple drivers to your problems. * First, decreasing bond quality with time indicates a plating issue. What's the actual thickness of your gold and nickel on the pads? * Second, the no-sticks indicate contamination. If it's organic, p
Electronics Forum | Thu Nov 03 02:34:46 EST 2005 | Rosewood
We've recently encountered some problems with wire bond strengths. I'm looking for anybody that has had some experience with different types of substrate contamination and methods for cleaning. There is no visible contamination on the gold pads, bu
Electronics Forum | Fri Jul 13 17:00:34 EDT 2007 | jmelson
Oh, sure, on fine-pitch parts you need a microscope or at least a good magnifier. But, OK, you have some kind of contamination. Solder is one thing, but where are these stainless, aluminum and copper particles coming from? Stainless makes me think
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